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SCI0402S-1N0KF Datasheet(PDF) 6 Page - Superworld Electronics |
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SCI0402S-1N0KF Datasheet(HTML) 6 Page - Superworld Electronics |
6 / 7 page SUPERWORLD ELECTRONICS (S) PTE LTD SCI0402S SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 15.01.2008 WIREWOUND CHIP INDUCTORS MIL-STD202F, METHOD 215D 6 Resistance to solvent test There shall be no case of deformation change in appearance of obliteration of marking Amplitude : 1.5mm Oscillation Frequency : 10 to 55 to 10Hz for 1 min. Test device shall be soldered on the substrate Time : 2hrs for each axis (X, Y, Z), total 6hrs. Pre-heating : 150°C, 1 min Solder Composition : Sn/Pb=63/67 Solder Temperature : 230±5°C Immersion Time : 20±2sec Solder Temperature : 260±5°C Immersion Time : 5±2sec The device should be REFLOW soldered (230±5°C for 10 seconds) to a tinned copper subs rate. A dynamiter force gauge should be applied to the side of the conponent. The device must withstand a minimum force of 2 or 4 pounds without a failure of the termination attached to component. Pre-heating : 150°C, 1min Solder Composition : Sn/Pb=63/67 Solder Temperature : 230±5°C Immersion Time : 4±1sec Drop 1 time for each face and 1 time for each corner. Total drop 10 times. Drop Height : 100cm Drop Weight : 125g after fluxing (alpha 100 or equiv), inductor shall be dipped in a melted solder bath at 232±5°C for 5 seconds. Drop Test 4 5 Solderability Test 3 Adhesion (Push Test) Component After test, the chip inductor don't fell of broke on the The terminal should at least be 90% covered with solder P.C.Board The electrodes shall be at least 90% covered with new solder coating. 3 Component Adhesion (Push Test) 2 1 Resistance to Soldering Heat Vibration Q change : within ±10% 1 lbs. For 0402 2 lbs. For 0603 3 lbs. For the rest Appearance : No damage Appearance : No damage L change : within ±5% Q change : within ±10% L change : within ±5% Mechanical Performance Test : ITEM SPECIFICATION TEST CONDITIONS / TEST METHODS |
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