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SDL1108-1R0MF Datasheet(PDF) 4 Page - Superworld Electronics |
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SDL1108-1R0MF Datasheet(HTML) 4 Page - Superworld Electronics |
4 / 5 page SUPERWORLD ELECTRONICS (S) PTE LTD HIGH CURRENT POWER INDUCTORS SDL1108 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 05.05.2008 8. RELIABILITY AND TEST CONDITION : Solder Temperature : 260±5°C High Temperature Low Temperature Humidity Resistance Life Test Thermal Shock Reliability Test Life Test 1. Appearance : No damage Temperature : 40±5°C Measure at room temperature after placing for 2 to 3 hrs. Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Flux for lead free : rosin 260°C 150°C Step 3 2 4 1 Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Temperature : 125±5°C Time : 500±12 hours Time : 500±12 hours Temperature : -40±5°C Conditions of 1 cycle. Dip Time : 10±0.5sec. Measure at room temperature after placing for 2 to 3 hrs. Total : 5 cycles 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. 2. Inductance : Within ±20% of initial value. Times (min.) 30±3 Within 3 Within 3 30±3 Room Temperature 125±3 Room Temperature Temperature (°C) -55±3 10±0.5 seconds 60 seconds Dipping Preheating Natural cooling Mechanical Performance Test Saturation Current (Isat) Solder Heat Resistance Heat Rated Current (Irms) Electrical Characteristics Test Solderability Test Inductance DCR ITEM LCR meter. 230°C 150°C After fluxing components shall be dipped in a melted Isat(A) will cause Lo to drop approximately 20%. Irms(A) will cause the coil temperature rise Solder : Sn-Ag3.0-Cu0.5 Preheat : 150°C, 60sec. solder bath at 230±5°C for 4 seconds. approximately T=40°C without core loss HP4284A, CH11025, CH3302, CH1320, CH1320S CH16502, Agilent33420A Micro-Ohm Meter. More than 90% of the terminal electrode should be covered with solder. 1. Components should have no evidence of electrical & mechanical damage. PERFORMANCE Refer to standard electrical characteristics list 4±1 seconds 60 seconds Dipping Preheating Natural cooling TEST CONDITION |
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