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AME385AEHA Datasheet(PDF) 6 Page - Analog Microelectronics |
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AME385AEHA Datasheet(HTML) 6 Page - Analog Microelectronics |
6 / 14 page AME 6 Shunt Bandgap Voltage Reference AME385-1.2 Rev.G.03 n Thermal Information * Measure θ JC on center of molding compound if IC has no tab. ** MIL-STD-202G 210F Parameter Package Die Attach Symbol Maximum Unit SOT-23 140 TO-92-2 TO-92-3 80 SOP-8 Conductive Epoxy 60 SOT-23 280 TO-92-2 TO-92-3 150 SOP-8 Conductive Epoxy 150 SOT-23 400 TO-92-2 TO-92-3 625 SOP-8 Conductive Epoxy 810 150 oC 350 oC Maximum Junction Temperature Solder Iron (10 Sec)** Thermal Resistance* (Junction to Case) Internal Power Dissipation PD Non-Conductive Epoxy Non-Conductive Epoxy mW oC / W Thermal Resistance (Junction to Ambient) θ JA oC / W θ JC Non-Conductive Epoxy |
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