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AME5130 Datasheet(PDF) 5 Page - Analog Microelectronics |
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AME5130 Datasheet(HTML) 5 Page - Analog Microelectronics |
5 / 16 page AME 5 AME5130 Micropower Step-Up DC/DC Converter Rev.F.02 Parameter Package Die Attach Symbol Maximum Unit Thermal Resistance* (Junction to Case) θ JC 81 Thermal Resistance (Junction to Ambient) θ JA 260 Internal Power Dissipation PD 400 mW 150 oC 350 oC oC / W Maximum Junction Temperature Solder Iron (10Sec)** SOT-25 Conductive Epoxy n Absolute Maximum Ratings n Recommended Operating Conditions Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device n Thermal Information * Measure θ JC on backside center of molding compund if IC has no tab. ** MIL-STD-202G 210F * HBM B: 2000V~3999V and SW pin pass 1500V only Parameter Symbol Maximum Unit Input Supply Voltage VIN 6 V RUN, VFB Voltages VRUN,VFB VIN V SW Voltage VSW VOUT+0.3 V N-Channel Switch Sink Current ISW 800 mA ESD Classification B* Parameter Symbol Rating Unit Ambient Temperature Range TA -40 to +85 oC Junction Temperature Range TJ -40 to +125 oC Storage Temperature Range TSTG -65 to +150 oC |
Similar Part No. - AME5130_1 |
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Similar Description - AME5130_1 |
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