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V5N180-B-10 Datasheet(PDF) 8 Page - Superworld Electronics |
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V5N180-B-10 Datasheet(HTML) 8 Page - Superworld Electronics |
8 / 10 page NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD 15.01.2008 HIGH VOLTAGE CHIP CAPACITORS V5N SERIES 8. SOLDERIND AND MOUNTING : 200 Gradual Cooling 70-90secs Figure 1. Re-flow Soldering Over 1min. Over 1min. 2-3secs. Figure 2. Wave Soldering Over 2mins. 250 Within 5secs. Figure 3. Hand Soldering 200 Soldering Preheating 350 Natural cooling Over 1min How to solder repair by solder iron : been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder iron. Sudden temp. change in components, results in a temp. gradient, and therefore may cause internal thermal cracks in the between the solvent and the chips must be less than 100°C. Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temp. difference on the components. The recommended heating rate depends on the size of the component, however it should not Natural cooling 2) recommended solder iron condition Most of the components are wave soldered with solder at 230~250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to Figure 2 for optimum soldering benefits. The required temp. of solder iron for any type of repair depends on the type of the tip, the substrate material, and the 1) Selection of soldering iron tip a) Preheat substrate to (60°C~120°C). c) Never contact the ceramic with the iron tip b) 350°C tip temperature (max) d) 3.0mm tip diameter (max) e) Use a 30 watt (max.) soldering iron with tip diameter of 3.0mm f) Limit soldering time to 5 secs. 8-3 Hand Soldering : Cooling condition : Preheating 260 217 Soldering solder land size exceed 3°C/sec. 8-1 Re-flow Soldering : 8-2 Wave Soldering : Soldering Preheating 300 250 230 cooling Natural components. In general a hand soldering method is not recommend unless proper preheating and handling practices have Preheat and gradual increase in temp. to the reflow temp. is recommended to decrease the potential of the thermal crack PG. 8 |
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