NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

15.01.2008

HIGH VOLTAGE CHIP CAPACITORS

V4N SERIES

8. SOLDERIND AND MOUNTING :

200

Gradual Cooling

70-90secs

Figure 1. Re-flow Soldering

Over

1min.

Over

1min.

2-3secs.

Figure 2. Wave Soldering

Over 2mins.

250

Within 5secs.

Figure 3. Hand Soldering

200

Soldering

Preheating

350

Natural

cooling

Over 1min

How to solder repair by solder iron :

been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder iron.

Sudden temp. change in components, results in a temp. gradient, and therefore may cause internal thermal cracks in the

between the solvent and the chips must be less than 100°C.

Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temp. difference

on the components. The recommended heating rate depends on the size of the component, however it should not

Natural

cooling

2) recommended solder iron condition

Most of the components are wave soldered with solder at 230~250°C. Adequate care must be taken to prevent the

potential of thermal cracks on the ceramic capacitors. Refer to Figure 2 for optimum soldering benefits.

The required temp. of solder iron for any type of repair depends on the type of the tip, the substrate material, and the

1) Selection of soldering iron tip

a) Preheat substrate to (60°C~120°C).

c) Never contact the ceramic with the iron tip

b) 350°C tip temperature (max)

d) 3.0mm tip diameter (max)

e) Use a 30 watt (max.) soldering iron with tip diameter of 3.0mm

f) Limit soldering time to 5 secs.

8-3 Hand Soldering :

Cooling condition :

Preheating

260

217

Soldering

solder land size

exceed 3°C/sec.

8-1 Re-flow Soldering :

8-2 Wave Soldering :

Soldering

Preheating

300

250

230

cooling

Natural

components. In general a hand soldering method is not recommend unless proper preheating and handling practices have

Preheat and gradual increase in temp. to the reflow temp. is recommended to decrease the potential of the thermal crack

PG. 11