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Z4C471-RF-10 Datasheet(PDF) 6 Page - Superworld Electronics

Part # Z4C471-RF-10
Description  FERRITE CHIP BEADS
Download  9 Pages
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Manufacturer  SUPERWORLD [Superworld Electronics]
Direct Link  http://www.superworld.com.sg
Logo SUPERWORLD - Superworld Electronics

Z4C471-RF-10 Datasheet(HTML) 6 Page - Superworld Electronics

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NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
04.07.2008
FERRITE CHIP BEADS
Z4 SERIES
9. SOLDERING AND MOUNTING :
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
9-1. Recommended PC Board Pattern
air soldering tools.
9-2.3 Soldering Iron (Figure 3) :
9-2.1 Lead Free Solder Re-flow :
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
Recommended temperature profiles for re-flow soldering in Figure 1.
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (max)
c) Never contact the ceramic with the iron tip
a soldering iron must be employed the following precautions are recommended.
Note :
9-2. Soldering
330
Over 2min.
Figure 2. Wave Soldering
Gradual
Cooling
Within 10s
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
d) 1.0mm tip diameter (max)
260
245
150
under mechanical stress as warping the board.
the mechanical stress to prevent failure.
Products shall be positioned in the sideway direction against
PC board should be designed so that products are not sufficient
Figure 3. Hand Soldering
Gradual
Cooling
Over 1min.
350
150
Preheating
Soldering
cooling
Natural
Preheating
Soldering
cooling
Natural
(max.)
(max.)
3s
10s
4.40
2.20
is shown in Fig. 2
Figure 1. Re-flow Soldering
Time(sec.)
60~150s
20~40s
Soldering
480s max.
60~180s
150
25
TP(260°C/10s max.)
217
200
Preheating
cooling
Natural


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