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THS5661AIPW Datasheet(PDF) 3 Page - Texas Instruments

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Part # THS5661AIPW
Description  12-BIT, 125 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

THS5661AIPW Datasheet(HTML) 3 Page - Texas Instruments

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THS5661A
12-BIT, 125 MSPS, CommsDAC
DIGITAL-TO-ANALOG CONVERTER
SLAS247 – NOVEMBER 1999
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
I/O
DESCRIPTION
AGND
20
I
Analog ground return for the internal analog circuitry
AVDD
24
I
Positive analog supply voltage (4.5 V to 5.5 V)
BIASJ
18
O
Full-scale output current bias
CLK
28
I
External clock input. Input data latched on rising edge of the clock.
COMP1
19
I
Compensation and decoupling node, requires a 0.1
µF capacitor to AVDD.
COMP2
23
I
Internal bias node, requires a 0.1
µF decoupling capacitor to AGND.
D[11:0]
[1:12]
I
Data bits 0 through 11.
D11 is most significant data bit (MSB), D0 is least significant data bit (LSB).
DGND
26
I
Digital ground return for the internal digital logic circuitry
DVDD
27
I
Positive digital supply voltage (3 V to 5.5 V)
EXTIO
17
I/O
Used as external reference input when internal reference is disabled (i.e., EXTLO = AVDD). Used as internal
reference output when EXTLO = AGND, requires a 0.1
µF decoupling capacitor to AGND when used as reference
output.
EXTLO
16
O
Internal reference ground. Connect to AVDD to disable the internal reference source.
IOUT1
22
O
DAC current output. Full scale when all input bits are set 1
IOUT2
21
O
Complementary DAC current output. Full scale when all input bits are 0
MODE
25
I
Mode select. Internal pulldown. Mode 0 is selected if this pin is left floating or connected to DGND. See
timing diagram.
NC
[13:14]
N
No connection
SLEEP
15
I
Asynchronous hardware power down input. Active high. Internal pulldown. Requires 5
µs to power down but 3 ms
to power up.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, AVDD (see Note 1)
–0.3 V to 6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DVDD (see Note 2)
–0.3 V to 6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage between AGND and DGND
–0.3 V to 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage range, AVDD to DVDD
–6.5 V to 6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CLK, SLEEP, MODE (see Note 2)
–0.3 V to DVDD + 0.3 V
. . . . . . . . . . . . . . . . . . . . . .
Digital input D11–D0 (see Note 2)
–0.3 V to DVDD + 0.3 V
. . . . . . . . . . . . . . . . . . . . .
IOUT1, IOUT2 (see Note 1)
–1 V to AVDD + 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COMP1, COMP2 (see Note 1)
–0.3 V to AVDD + 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . .
EXTIO, BIASJ (see Note 1)
–0.3 V to AVDD + 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
EXTLO (see Note 1)
–0.3 V to 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak input current (any input)
20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak total input current (all inputs)
–30 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA: THS5661AI
–40
°C to 85°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range
– 65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Measured with respect to AGND.
2. Measured with respect to DGND.


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