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GFCC30 Datasheet(PDF) 1 Page - Gunter Seniconductor GmbH. |
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GFCC30 Datasheet(HTML) 1 Page - Gunter Seniconductor GmbH. |
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1 / 1 page Gunter Semiconductor GmbH Gunter Semiconductor GmbH Gunter Semiconductor GmbH Gunter Semiconductor GmbH GFCC30 N Channel Power MOSFET with low RDS(on) Chip Specification General Description: * Advanced Process Technology * Dynamic dV/dt Rating * 150℃ ℃ ℃ ℃ Operating Temperature * Fast Switching * Fully Avalanche Rated * Low RDS(on) Mechanical Data: D16 Dimension 2.95mm x 4.75mm Thickness: 400 µµµµm Metallization: Top : : Al Backside : CrNiAg / Au Suggested Bonding Conditions: Die Mounting: Solder Perform 95/5 PbSn or 92.5./2.5/5 PbAgIn Source Bonding Wire: 8 mil Al Absolute Maximum Rating @Ta=25℃ ℃ ℃ ℃ Characteristics Symbol Limit Unit Test Conditions Drain-to-Source Breakdown Voltage V(BR)DSS 600 V VGS=0V, ID=250 µΑ Static Drain-to - Source On-resistance RDS(ON) 2.2 Ω VGS=10V, ID=2.2 Α Continuous Drain current ( in target package) ID@25℃ 27 A VGS=10V Continuous Drain current ( in target package) ID@100℃ 19 A VGS=10V Operation Junction Tj -55~150 ℃ Storage Temperature TSTR -55~150 ℃ Target Device: IRFBC30 TO-220AB PD 74 W @Tc=25℃ |
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