Oplink Communications,

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nc.

Electrical Pad Layout

H ost B oard C onnector Pad Layout

Tow ard

B ezel

Tow ard

A SIC

20

19

18

17

16

15

14

13

12

11

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

TX G ND

TD- (TX DATA IN-)

TD+ (TX DATA IN+)

TX G ND

VccTX

VccRX

RX G ND

RD+ (RX DATA OU T+)

RD- (RX DATA OU T-)

RX G ND

1

2

3

4

5

6

7

8

9

10

TX G ND

TX Fault

TX Disable

MOD_DEF(2)

MOD_DEF(1)

MOD_DEF(0)

NO CONNECTION

LOS

RX G ND

RX G ND

Bottom of Board

(as viewed thru top of board)

Top of Board

TR PE 12-E 2 Single Mode Multi-rate

3

Parameter

Symbol

Minimum

Typical

Maximum

Units

V

PP-DIF

0.25

-

2.4

V

V

IH

2.0

-

V

CC

V

V

IL

0

-

0.8

V

V

OH

2.0

-

V

V

V

OL

0

-

0.8

V

1

Di erential peak-to-peak voltage.

2

There is an internal 4.7 to 10k pull-up resistor to VccT.

3

Open collector compatible,4.7 to 10k pull-up resistor to Vcc (H ost Supply Voltage).

Parameter

Symbol

Minimum

Typical

Maximum

Units

V

PP-DIF

0.6

-

2.0

V

V

OH

2.0

-

V

V

V

OL

0

-

0.5

V

1

Di erential peak-to-peak voltage across external 100 load.

2

Open collector compatible,4.7 to 10k pull-up resistor to Vcc (H ost Supply Voltage).

Parameter

Symbol

Minimum

Typical

Maximum

Units

Supply Voltage

V

CC

3.13

3.3

3.47

V

Supply Current

I

CC

-

190

220

mA

MO D _D EF(0)

pin 6

MO D _D EF(1)

pin 5

MO D _D EF(2)

pin 4

Interpretation by H ost

TTL LOW

SCL

SDA

Serial module definition protocol

Module D efinition

21737-0970,Rev.A

2008-11-11