Oplink Communications,

I

nc.

Electrical Pad Layout

H ost B oard C onnector Pad Layout

Tow ard

B ezel

Tow ard

A SIC

20

19

18

17

16

15

14

13

12

11

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

TX GND

TD- (TX DATA IN-)

TD+ (TX DATA IN+)

TX GND

VccTX

VccRX

RX GND

RD+ (RX DATA OUT+)

RD- (RX DATA OUT-)

RX GND

Top of Board

1

2

3

4

5

6

7

8

9

10

TX GND

TX Fault

TX Disable

MOD_DEF(2)

MOD_DEF(1)

MOD_DEF(0)

NO CONNECTION

LOS

RX GND

RX GND

Bottom of Board

(as view ed thru top of board)

Transmitter Performance C haracteristics

TRPE48K E2 CWDM

(Over Operating Case Temperature. V

Parameter

Symbol

Minimum

Typical

Maximum

Units

V

PP-DIF

0.35

-

1.75

V

V

IH

2.0

-

V

CC

V

V

IL

0

-

0.8

V

V

OH

2.0

-

V

V

V

OL

0

-

0.8

V

1

Di erential peak-to-peak voltage.

2

There is an internal 4.7 to 10k pull-up resistor to VccT.

3

Open collector compatible, 4.7 to 10k pull-up resistor to Vcc (Host Supply Voltage).

R eceiver Electrical Interface

Parameter

Symbol

Minimum

Typical

Maximum

Units

Supply Voltage

V

CC

3.13

3.3

3.47

V

Supply Current

I

CC

-

210

350

mA

Parameter

Symbol

Minimum

Typical

Maximum

Units

V

PP-DIF

0.40

-

1.75

V

V

OH

V

-

V

V

V

OL

0

-

0.5

V

1

Di erential peak-to-peak voltage across external 100 load.

2

Open collector compatible, 4.7 to 10k pull-up resistor to Vcc (Host Supply Voltage).

(Over Operating Case Temperature. V

Module D efinition

MO D _D EF(0)

pin 6

MO D _D EF(1)

pin 5

MO D _D EF(2)

pin 4

Interpretation by H ost

TTL LOW

SCL

SDA

Serial module de nition protocol

3

21737-0976, Rev.A

2009-02-20