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CHP1X-100-1001-F-BLK Datasheet(PDF) 1 Page - IRC - a TT electronics Company.

Part # CHP1X-100-1001-F-BLK
Description  Metal Glaze??Cylindrical Official Size Power Resistor
Download  2 Pages
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Manufacturer  IRCTT [IRC - a TT electronics Company.]
Direct Link  http://www.irctt.com
Logo IRCTT - IRC - a TT electronics Company.

CHP1X-100-1001-F-BLK Datasheet(HTML) 1 Page - IRC - a TT electronics Company.

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General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Metal Glazethick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over
nickel barrier
High Purity ceramic
core for optimal
thermal
distribution
Metal Glaze™ Cylindrical
Official Size
Power Resistor
CHP1X Series
0.1 ohm to 10K ohm
Outstanding surge capacity
1W in a 1/2W package (2010 footprint)
150°C maximum operating temperature
Electrical Data
Size
Code¹
Industry
Footprint
IRC
Type
Maximum
Power Rat-
ing
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
Tolerance
(±%)³
TCR
(±%)³
Product Category
D
2010
CHP 1X
1W @ 70°C
300
600
0.1 to 0.99
1, 2, 5
100
Low Range
1.0 to 10K
1, 2, 5
50, 100
Standard
² Not to exceed P x R
³ Consult factory for tighter TCR, tolerance, or resistance values
Environmental Data
Characteristics
Maximum Change
Test Method
Temperature Coefficient
As specified
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
Thermal Shock
±0.5% + 0.01 ohm
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation
±0.25% + 0.01 ohm
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload
±0.5% + 0.01 ohm
±1% for R>100K ohm
MIL-R-55342E Par 4.7.5
2.5 x P x R for 5 seconds
High Temperature Exposure
±0.5% + 0.01 ohm
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure
±0.25% + 0.01 ohm
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at
260°C for 10 seconds)
Solderability
95% minimum coverage
MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance
±0.5% + 0.01 ohm
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test
±0.3% + 0.01 ohm
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength
±1% + 0.01 ohm
no mechanical damage
1200 gram push from underside of mounted chip for
60 seconds
Resistance to Board Bending
±1% + 0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, deflected
5mm so as to exert pull on chip contacts for 10 seconds
CHP1X Series Issue September 2008 Sheet 1 of 2


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