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SIP-4761HT-03-1001JC Datasheet(PDF) 1 Page - IRC - a TT electronics Company. |
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SIP-4761HT-03-1001JC Datasheet(HTML) 1 Page - IRC - a TT electronics Company. |
1 / 3 page General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA © IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com · Inherent reliability · Custom configurations available · Bonded leads not susceptible to solder reflow problems · Absolute tolerence to ±0.1% - ratio accuracy to ±0.05% · Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C 1900HT / 4700HT SERIES IRC Advanced Film Division The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low profile, TaNFilm® DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part. Electrical Data TaNFilm® High Temperature DIP and SIP Networks Package Type Size Schematic Ohmic Range Package Power Element Power Rated Voltage (not to exceed rated power) Temperature Range DIP 14 Isolated Schematic A 100Ω to 100KΩ 1.12W 0.08W 100V -55°C to +200°C Bussed Schematic B 1.00KΩ to 50KΩ 16 Isolated Schematic A 100Ω to 100KΩ 1.28W Bussed Schematic B 1.00KΩ to 50KΩ SIP 6 Isolated Schematic G 50Ω to 50KΩ 0.24W 0.08W 50V Bussed Schematic C 2.00KΩ to 25KΩ 8 Isolated Schematic G 50Ω to 50KΩ 0.32W Bussed Schematic C 2.00KΩ to 25KΩ Sputtered tantalum nitride with passivation oxide layer Thermo-compression bonded leads provide exceptional reliability Ceramic sandwich construction with high temperature epoxy encapsulent HT Series Issue November 2008 Sheet 1 of 3 |
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