SPECIFICATIONS

FEATURES AND SPECIFICATIONS

1.00mm (.039”) Pitch

PCI Express* connector

87715

Vertical, Through Hole

Molex offers the new PCI Express* revision 2 specs connectors in a through hole

configuration for high-bandwidth workstation and server applications

PCI Express is a third generation I/O architecture. PCI-SIG* recently revised the

PCI Express specifications from version 1.1 to version 2.0. This revision doubles

the PCI Express interconnect bit rate from 2.5 GT/s (gigatransfer per second) to

5 GT/s per lane. Unlike the previous version in which the PCI bus was

implemented via multi-drop parallel architecture, the PCI Express incorporates a

point-to-point signaling using differential pairs. A 16-lane link now could provide

approximately 16Gbps of data-transfer. With this increase in signaling speed,

the PCI Express now provides better support to high-bandwidth applications. It

is also backward compatible with current PCI Express 1.1 version products.

Molex’s through hole connector version of the PCI Express version 2.0 specs

provides customers design flexibility for a narrower interconnect links. This

would improve data-transfer at a lower cost.

All Molex PCI Express connectors are compliant with PCI-SIG* specifications. For

more information on these specifications please see www.pcisig.com

*PCI Express, ExpressModule, and PCI-SIG are trademarks of PCI-SIG

Features

Benefits

available in the market.

down, facilitates connection in cramped spaces

Reference Information

Packaging: Tray

UL File No.: TBD

CSA File No.: TBD

Mates With: PCI Express Card

Designed In: mm

Electrical

Voltage: 50 Volts AC (RMS)/DC

Current: 1.1A

Contact Resistance: 30 milliohms max

Dielectric Withstanding Voltage: 500V AC

Insulation Resistance: 1000 Megohms min

Mechanical

Max Terminal Retention Force: 5 N min/Terminal

Mating Force: 1.15 N max/contact pair

Unmating Force: 0.15 N min/contact pair

Durability: 50 Cycles

Physical

Housing: High Temperature Nylon, UL 94V-0

Contact: Copper Alloy

Plating:

Contact Area —0.76 µm Gold or 0.38 µm Gold

Solder Tail Area — Tin

Underplating — Nickel

Operating Temperature: - 55 ºC to +85 ºC