TPA005D02

2-W STEREO CLASS-D AUDIO POWER AMPLIFIER

SLOS227C – AUGUST 1998 – REVISED MARCH 2000

10

POST OFFICE BOX 655303

THERMAL INFORMATION

The thermally enhanced DCA package is based on the 56-pin TSSOP, but includes a thermal pad (see Figure 11)

to provide an effective thermal contact between the IC and the PWB.

Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type

packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,

however, have only two shortcomings: they do not address the very low profile requirements (< 2 mm) of many of

today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing

integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that

severely limits the usable range of many high-performance analog circuits.

The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal

performance comparable to much larger power packages.

The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and

limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that

remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing

technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally

coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can

be reliably achieved.

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

Figure 11. Views of Thermally Enhanced DCA Package

selection of components

Figure 12 is a schematic diagram of a typical notebook computer application circuit.