TPA0212

STEREO 2-W AUDIO POWER AMPLIFIER

WITH FOUR SELECTABLE GAIN SETTINGS AND MUX CONTROL

SLOS284 – NOVEMBER 1999

1

POST OFFICE BOX 655303

Into 10-k

Ω Load

External Gain-Setting Resistors

24-Pin TSSOP PowerPAD

™

description

The TPA0212 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of

delivering 2 W of continuous RMS power per channel into 3-

Ω loads. This device minimizes the number of

external components needed, simplifying the design, and freeing up board space for other features. When

driving 1 W into 8-

Ω speakers, the TPA0212 has less than 0.8% THD+N across its specified frequency range.

Included within this device is integrated depop circuitry that virtually eliminates transients that cause noise in

the speakers.

Amplifier gain is internally configured and controlled by way of two terminals (GAIN0 and GAIN1). BTL gain

settings of 2, 6, 12, and 24 V/V are provided, while SE gain is always configured as 1 V/V for headphone drive.

An internal input MUX allows two sets of stereo inputs to the amplifier. The HP/LINE terminal allows the user

to select which MUX input is active regardless of whether the amplifier is in SE or BTL mode. In notebook

applications, where internal speakers are driven as BTL and the line outputs (often headphone drive) are

required to be SE, the TPA0212 automatically switches into SE mode when the SE/BTL input is activated, and

this reduces the gain to 1 V/V.

The TPA0212 consumes only 6 mA of supply current during normal operation. A miserly shutdown mode

reduces the supply current to less than 150

µA.

The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable only

in TO-220-type packages. Thermal impedances of approximately 35

°C/W are readily realized in multilayer PCB

applications. This allows the TPA0212 to operate at full power into 8-

Ω loads at an ambient temperature of 85°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright

© 1999, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

PWP PACKAGE

(TOP VIEW)

GND

GAIN0

GAIN1

LOUT+

LLINEIN

LHPIN

RIN

LOUT–

LIN

BYPASS

GND

GND

RLINEIN

SHUTDOWN

ROUT+

RHPIN

HP/LINE

ROUT–

SE/BTL

PC-BEEP

GND

PowerPAD is a trademark of Texas Instruments Incorporated.