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TPS2206IDFLE Datasheet(PDF) 4 Page - Texas Instruments |
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TPS2206IDFLE Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page TPS2206 DUAL-SLOT PC CARD POWER-INTERFACE SWITCH WITH RESET FOR SERIAL PCMCIA CONTROLLER SLVS138B – MAY 1996 – REVISED JUNE 1998 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION DB, DF DAP 3.3V 15, 16, 17 16, 17, 18 I 3.3-V VCC input for card power 5V 1, 2, 30 1, 2, 32 I 5-V VCC input for card power and/or chip power 12V 7, 24 8, 25 I 12-V Vpp input for card power AVCC 9, 10, 11 10, 11, 12 O Switched output that delivers 0 V, 3.3 V, 5 V, or high impedance to card AVPP 8 9 O Switched output that delivers 0 V, 3.3 V, 5 V, 12 V, or high impedance to card BVCC 20, 21, 22 21, 22, 23 O Switched output that delivers 0 V, 3.3 V, 5 V, or high impedance BVPP 23 24 O Switched output that delivers 0 V, 3.3 V, 5 V, 12 V, or high impedance CLOCK 4 5 I Logic-level clock for serial data word DATA 3 4 I Logic-level serial data word GND 12 13 Ground LATCH 5 6 I Logic-level latch for serial data word NC 13, 19, 25, 26, 27, 28, 29 3, 19, 26, 27, 28, 29, 30, 31 No internal connection OC 18 20 O Logic-level overcurrent. OC reports output that goes low when an overcurrent condition exists RESET 6 7 I Logic-level RESET input active high. Do not connect if terminal 14 is used. RESET 14 14 I Logic-level RESET input active low. Do not connect if terminal 6 is used. absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Input voltage range for card power: VI(5V) – 0.3 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VI(3.3V) – 0.3 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VI(12V) – 0.3 V to 14 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic input voltage – 0.3 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current (each card): IO(xVCC) internally limited . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IO(xVPP) internally limited . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating virtual junction temperature range, TJ –40 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature range, TA –40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg –55 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR‡ ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING DB 1024 mW 8.2 mW/ °C 655 mW 532 mW DF 1158 mW 9.26 mW/ °C 741 mW 602 mW DAP No backplane 1625 mW 13 mW/ °C 1040 mW 845 mW DAP Backplane§ 6044 mW 48.36 mW/ °C 3869 mW 3143 mW ‡ These devices are mounted on an FR4 board with no special thermal considerations. § 2-oz backplane with 2-oz traces; 5.2-mm × 11-mm thermal pad with 6-mil solder; 0.18-mm diameter vias in a 3×6 array. |
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