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BQ24382DSGT Datasheet(PDF) 4 Page - Texas Instruments |
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BQ24382DSGT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 18 page DEVICE INFORMATION IN VSS NC FAULT OUT NC VBAT CE bq2438x 1 2 3 4 8 7 6 5 bq24380 bq24381 bq24382 SLUS805B – APRIL 2008 – REVISED MARCH 2009......................................................................................................................................................... www.ti.com TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. IN 1 I Input power, connected to external DC supply. Bypass IN to VSS with a ceramic capacitor (1 µF minimum) VSS 2 – Ground terminal. Connect to the thermal pad and to the ground rail of the circuit. NC 3, 7 Do not connect to any external circuits. These pins may have internal connections used for test purposes. Open-drain device status output. FAULT is pulled to VSS internally when the input pass FET has been turned FAULT 4 O off due to input overvoltage or output short-circuit conditions, an overtemperature condition, or because the battery voltage is outside safe limits. FAULT is high impedance during normal operation. Active-low chip enable input. Connect CE = HI to turn the input pass FET off. Connect CE = LOW to turn the CE 5 I internal pass FET on and connect the input to the charging circuitry. CE is Internally pulled down, ~200 k Ω. VBAT 6 I Battery voltage sense input. Connected to pack positive terminal through a 100-k Ω resistor. OUT 8 O Output terminal to the charging system. Bypass OUT to VSS with a ceramic capacitor (1 µF minimum) The thermal pad is electrically connected to VSS internally. The thermal pad must be connected to the same Thermal PAD potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times. 4 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 bq24382 |
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