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OARS3R005JLF Datasheet(PDF) 4 Page - IRC - a TT electronics Company. |
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OARS3R005JLF Datasheet(HTML) 4 Page - IRC - a TT electronics Company. |
4 / 4 page Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com February 2009 Issue Page 4 of 4 • 4222 South Staples Street • Corpus Christi Texas 78411 USA OARS-3 Open Air Sense Resistors Metal Alloy Strip Note 1 : Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2 : The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD pack- ages may still exist. Note 3 : Components intended for use in “lead- free” assembly process shall be evaluated using the “lead-free” peak temperature and profiles defined in Table 1, 2 and reflow profile whether or not lead-free. Tabel 1: SnPb Eutectic Process - Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 ≥ 350 < 2.5 mm 240 +0/-5°C 225 +0/-5°C ≥ 2.5 mm 225 +0/-5°C 225 +0/-5°C Tabel 2: Pb-free Process - Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6 mm 260°C * 260°C * 260°C * 1.6 mm - 2.5 mm 260°C * 250°C * 245°C * ≥ 2.5 mm 250°C * 245°C * 245°C * * Tolerance: The device manufacturer/supplier shall assure process compat- ibility up to and including the stated classification temperature at the rated MSL level. Note 1 : All temperatures refer to topside of the package, measured on the package body surface. Note 2 : Time within 5 °C of actual peak temperature (tp) specified for the reflow profiles is a “supplier” minimum and a “user” maximum. Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average Ramp-up rate (Tsmax to Tp) 3°C / second max. 3°C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100°C 150°C 60 -120 seconds 150°C 200°C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183°C 60 - 150 seconds 217°C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 Time within 5°C of actual Peak Temperature (tp)2 10 - 30 seconds 20 - 40 seconds Ramp-down Rate 6°C / second max. 6°C / second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Sn-Pb Eutectic and Pb-Free Reflow Profiles Time Critical Zone T L to TP Ramp-down Ramp-up t 25°C to Peak T P T L T smax T smin t s Preheat t L 25 t P * Based on Industry Standards and IPC recommendations IRC Solder Reflow Recommendations |
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