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MMC03101001503D7 Datasheet(PDF) 1 Page - IRC - a TT electronics Company. |
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MMC03101001503D7 Datasheet(HTML) 1 Page - IRC - a TT electronics Company. |
1 / 3 page General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal Glaze™ General Purpose Surface Mount Power Resistor MM Series • Up to 2 watts • Up to 1000 volts • 0.1 ohm to 2.2 megohm range • 150°C maximum operating temperature Electrical Data Size Code Industry Footprint IRC Type Maximum Power Rating Working Voltage² Resistance Range (ohms) Tolerance (+%)³ TCR (ppm/°C)³ Product Category B 1206 MMA0204 1/2 400 0.1 to 0.99 1, 2, 5 100 Low Range 1.0 to 1.0M 1, 2, 5 50, 100 Standard 20 to 348K 0.25, 0.5 50, 100 Tight Tolerance F 2512 MMB0207 1 700 0.1 to 0.99 1, 2, 5 100 Low Range 1.0 to 2.21M 1, 2, 5 50, 100 Standard 20 to 348K 0.25, 0.5 50, 100 Tight Tolerance H 3610 MMC0310 2 1000 0.1 to 0.99 1, 2, 5 100 Low Range 1.0 to 2.21M 1, 2, 5 50, 100 Standard ¹Not to exceed √P x R ²Consult factory for tighter TCR, tolerance, or resistance values. Environmental Data Characteristics Maximum Change Test Method Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C +125°C) Thermal Shock ±0.5% +0.01 Ω MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) Low Temperature Operation ±0.25% +0.01 Ω MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% +0.01 Ω ±1% for R>100K Ω MIL-R-55342E Par 4.7.5 2.5 x √P x R for 5 seconds High Temperature Exposure ±0.5% +0.01 Ω MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% +0.01 Ω MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Moisture Resistance ±0.5% +0.01 Ω MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) Life Test ±0.5% +0.01 Ω MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent) Terminal Adhesion Strength ±1% +0.01 Ω no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds Resistance to Board Bending ±0.5% +0.01 Ω no mechanical damage Chip mounted in center of 90mm long board, deflected 5mm so as to exert pull on chip contacts for 10 seconds Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate High temperature dielectric coating 60/40 Solder over nickel barrier MM Series Issue March 2009 Sheet 1 of 3 |
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