PRELIMINARY
CY2XF32
Document Number: 001-53147 Rev. *A
Page 4 of 8
Absolute Maximum Conditions
Parameter
Description
Condition
Min
Max
Unit
VDD
Supply Voltage
–0.5
4.4
V
VIN[1]
Input Voltage, DC
Relative to VSS
–0.5
VDD+0.5
V
TS
Temperature, Storage
Non operating
–55
135
°C
TJ
Temperature, Junction
–40
135
°C
ESDHBM
ESD Protection (Human Body Model)
JEDEC STD 22-A114-B
2000
–
V
ΘJA[2]
Thermal Resistance, Junction to Ambient
0 m/s airflow
64
°C/W
Operating Conditions
Parameter
Description
Min
Typ
Max
Unit
VDD
3.3V Supply Voltage Range
3.135
3.3
3.465
V
2.5V Supply Voltage Range
2.375
2.5
2.625
V
TPU
Power Up Time for VDD to Reach Minimum Specified Voltage (Power Ramp
is Monotonic)
0.05
–
500
ms
TA
Ambient Temperature, Commercial
0
–
70
°C
Ambient Temperature, Industrial
–40
–
85
°C
CLOAD
Load Capacitance at CLK (>100 MHz)
–
–
10
pF
Load Capacitance at CLK (
≤100 MHz)
–
–
15
pF
Notes
1. The voltage on any input or I/O pin cannot exceed the power pin during power up.
2. Simulated. The board is derived from the JEDEC multilayer standard. It measures 76 x 114 x 1.6 mm and has four layers of copper (2/1/1/2 oz.). The internal layers
are 100% copper planes, while the top and bottom layers have 50% metalization. No vias are included in the model.
DC Electrical Characteristics
Parameter
Description
Condition
Min
Typ
Max
Unit
IDD
Operating Supply Current
VDD = 3.465V, OE/PD# = VDD, output
unloaded
––
110
mA
ISB
Standby Supply Current
PD# = VSS
–
–
250
μA
VOH
Output High Voltage
VDD = min, IOH = –4 mA
0.9*VDD
––
V
VOL
Output Low Voltage
VDD = max, IOL = 4 mA
–
–
0.1*VDD
V
IOZ
Output Leakage Current
OE/PD# = VSS
–35
–
35
μA
VIH
Input High Voltage
0.7*VDD
––
V
VIL
Input Low Voltage
–
–
0.3*VDD
V
IIH0
Input High Current, OE/PD# Pin
Input = VDD
––
115
μA
IIH1
Input High Current, FS0 & FS1 Pins Input = VDD
––
10
μA
IIL0
Input Low Current, OE/PD# Pin
Input = VSS
–50
–
–
μA
IIL1
Input Low Current, FS0 & FS1 Pin
Input = VSS
–20
–
–
μA
CIN0[3]
Input Capacitance, OE/PD# Pin
–
15
–
pF
CIN1[3]
Input Capacitance, FS0 & FS1 Pin
–
4
–
pF
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