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CY7C1312JV18 Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1312JV18
Description  18 Mbit QDR-II SRAM 2-Word Burst Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1312JV18 Datasheet(HTML) 1 Page - Cypress Semiconductor

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18 Mbit QDR™-II SRAM 2-Word
Burst Architecture
CY7C1310JV18, CY7C1910JV18
CY7C1312JV18, CY7C1314JV18
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document #: 001-43127 Rev. *A
Revised July 31, 2009
Features
Separate independent read and write data ports
Supports concurrent transactions
250 MHz clock for high bandwidth
2-word burst on all accesses
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 500 MHz) at 250 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR™-II operates with 1.5 cycle read latency when Delay Lock
Loop (DLL) is enabled
Operates similar to a QDR-I device with 1 cycle read latency
in DLL off mode
Available in x 8, x 9, x 18, and x 36 configurations
Full data coherency, providing most current data
Core VDD = 1.8V (±0.1V); I/O VDDQ = 1.4V to VDD
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
DLL for accurate data placement
Configurations
CY7C1310JV18 – 2M x 8
CY7C1910JV18 – 2M x 9
CY7C1312JV18 – 1M x 18
CY7C1314JV18 – 512K x 36
Functional Description
The CY7C1310JV18, CY7C1910JV18, CY7C1312JV18, and
CY7C1314JV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has data outputs to
support read operations and the write port has data inputs to
support write operations. QDR-II architecture has separate data
inputs and data outputs to completely eliminate the need to “turn
around” the data bus required with common I/O devices. Access
to each port is accomplished through a common address bus.
The read address is latched on the rising edge of the K clock and
the write address is latched on the rising edge of the K clock.
Accesses to the QDR-II read and write ports are completely
independent of one another. To maximize data throughput, both
read and write ports are provided with DDR interfaces. Each
address
location
is
associated
with
two
8-bit
words
(CY7C1310JV18), 9-bit words (CY7C1910JV18), 18-bit words
(CY7C1312JV18), or 36-bit words (CY7C1314JV18) that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K and C and C), memory bandwidth is maximized
while simplifying system design by eliminating bus “turn
arounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
Description
250 MHz
Unit
Maximum Operating Frequency
250
MHz
Maximum Operating Current
x8
735
mA
x9
735
x18
800
x36
900
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