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UCC5640PW28 Datasheet(PDF) 2 Page - Texas Instruments |
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UCC5640PW28 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 10 page UCC5640 SLUS314C – JANUARY 2000 – REVISED JUNE 2003 2 www.ti.com ORDERING INFORMATION T PACKAGED DEVICE { TA TSSOP-24 (PW) TSSOP-28 (PW) 0 °C to 70°C UCC5640PW24 UCC5640PW28 † The TSSOP packages are available taped and reeled. Add TR suffix to device type (e.g. UCC5640PW24TR) to order quantities of 2,000 devices per reel. CONNECTION DIAGRAM TSSOP–24 (Top View) PW Package TSSOP–28 (Top View) PW Package DIFFB L6+ L8– L8+ L7– TRMPWR L1+ N/C L4– L3+ L4+ L1– L2+ L2– REG L3– DIFSENS L7+ L6– L5– N/C GND 14 13 12 11 10 9 8 7 6 5 4 3 2 1 15 16 17 18 19 20 21 22 23 24 25 26 27 28 L5+ N/C DISCNCT L9– L9+ LVD DIFFB L6+ L8– L8+ L7– TRMPWR L1+ L4– L3+ L4+ L1– L2+ L2– REG L3– DIFSENS L7+ L6– L5– 12 11 10 9 8 7 6 5 4 3 2 1 13 14 15 16 17 18 19 20 21 22 23 24 L5+ L9– L9+ GND DISCNCT RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT TRMPWR voltage 2.7 5.25 V Signal line voltage 0 3.6 V Disconnect input voltage 0 TRMPWR °C ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted {} UCC5640 UNIT TRMPWR voltage 6 V Signal line voltage 0 to 3.6 V Package dissipation 1 W Storage temperature, Tstg –65 to 150 Operating junction temperature, TJ –55 to 150 °C Lead temperature (soldering, 10 sec.) 300 C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into and negative out of, the specified terminal. ‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. All voltages are referenced to GND. |
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