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VTM™ Current Multiplier

V048F240T012

Rev. 2.9

Page 8 of 11

RECOMMENDED LAND PATTERN

(NO GROUNDING CLIPS)

TOP SIDE SHOWN

RECOMMENDED LAND PATTERN

(With GROUNDING CLIPS)

TOP SIDE SHOWN

NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE

FREE OF COPPER, ALL PCB LAYERS.

2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],

THIS PROVIDES 7.00 [0.275] COMPONENT

EDGE-TO-EDGE SPACING, AND 0.50 [0.020]

CLEARANCE BETWEEN VICOR HEAT SINKS.

(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],

THIS PROVIDES 8.50 [0.334] COMPONENT

EDGE-TO-EDGE SPACING, AND 2.00 [0.079]

CLEARANCE BETWEEN VICOR HEAT SINKS.

3. V•I CHIP™ MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;

ACTUAL LAND PATTERN MAY DIFFER.

DIMENSIONS FROM EDGES OF LAND PATTERN

TO PUSH-PIN HOLES WILL BE THE SAME FOR

ALL FULL SIZE V•ICHIP PRODUCTS.

4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.

5. UNLESS OTHERWISE SPECIFIED:

DIMENSIONS ARE MM [INCH].

TOLERANCES ARE:

X.X [X.XX] = ±0.3 [0.01]

X.XX [X.XXX] = ±0.13 [0.005]

6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)

SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND

DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.