2.4GHz SiGe Linear Power Amplifier

2

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ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

RF Input Power (50Ω source)...........................................+5dBm

RF_IN Input Current............................................................±1mA

Maximum VSWR Without Damage ........................................10:1

(derate 28.5mW/°C above +70°C) ..................................1.3W

Thermal Resistance (Note 1)............................................35°C/W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +125°C

UCSP Bump Temperature (soldering) (Note 2)

Infrared (15s) ...............................................................+220°C

Vapor Phase (60s) .......................................................+215°C

WLP Bump Soldering Temperature .................................+250°C

Continuous Operating Lifetime.....................10yrs

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

2.7

4.2

V

317

350

345

Idle current = 250mA

305

Refer to the MAX2247 EV kit for details.

175

Refer to the MAX2247 EV kit for details.

120

Supply Current (Notes 4, 5)

Refer to the MAX2247 EV kit for details.

85

mA

Shutdown Supply Current

SHDN = 0, no RF signal applied

0.5

10

µA

Digital Input Logic High

2V

Digital Input Logic Low

0.8

V

Digital Input Current High

-1

+5

µA

Digital Input Current Low

-1

+1

µA

CAUTION! ESD SENSITIVE DEVICE

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not recommended.