MAX4684 datasheet(2/10 Pages) MAXIM

Part #	MAX4684

Description	0.5Ω/0.8Ω Low-Voltage, Dual SPDT Analog Switches in UCSP

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Manufacturer	MAXIM [Maxim Integrated Products]

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2 / 10 page

0.5

Ω

Ω/0.8Ω

Ω Low-Voltage, Dual SPDT

Analog Switches in UCSP

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All Voltages Referenced to GND)

V+, IN_......................................................................-0.3V to +6V

COM_, NO_, NC_ (Note1) ........................... -0.3V to (V+ + 0.3V)

Continuous Current NO_, NC_, COM_ .......................... ±300mA

Peak Current NO_, NC_, COM_

(pulsed at 1ms, 50% duty cycle).................................±400mA

Peak Current NO_, NC_, COM_

(pulsed at 1ms, 10% duty cycle).................................±500mA

Continuous Power Dissipation (TA = +70°C)

10-Pin TDFN (derate 18.5mW/°C above +70°C)........1482mW

12-Bump UCSP (derate 11.4mW/°C above +70°C) ...909mW

10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW

Operating Temperature Ranges..........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Bump Temperature (soldering) (Note 2)

Infared (15s)................................................................+220°C

Vapor Phase (60s) ......................................................+215°C

Note 1: Signals on NO_, NC_, and COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to

maximum current rating.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre-

heating is required. Hand or wave soldering is not allowed.

PARAMETER

SYMBOL

CONDITIONS

TA

MIN

TYP

MAX

UNITS

ANALOG SWITCH

Analog Signal Range

VNO_, VNC_,

VCOM_

E0

V+

V

+25

°C

0.3

0.5

MAX4684

E

0.5

+25

°C0.45

0.8

NC_ On-Resistance

(Note 4)

RON(NC)

V+ = 2.7V; ICOM_ = 100mA;

VNC_ = 0 to V+

MAX4685

E

0.8

Ω

+25

°C0.45

0.8

NO_ On-Resistance

(Note 4)

RON(NO)

V+ = 2.7V; ICOM_ = 100mA;

VNO_ = 0 to V+

E

0.8

Ω

+25

°C0.06

On-Resistance Match

Between Channels

(Notes 4, 5)

ΔRON

V+ = 2.7V; ICOM_ = 100mA;

VNO_ or VNC_ = 1.5V

E

0.06

Ω

MAX4684

E

0.15

NC_ On-Resistance

Flatness (Note 6)

RFLAT (NC)

V+ = 2.7V; ICOM = 100mA;

VNC_ = 0 to V+

MAX4685

E

0.35

Ω

NO_ On-Resistance

Flatness (Note 6)

RFLAT (NO)

V+ = 2.7V; ICOM = 100mA;

VNO_ = 0 to V+

E

0.35

Ω

+25

°C

-1

1

NO_ or NC_ Off-

Leakage Current

(Note 7)

INO_(OFF) or

INC_(OFF)

V+ = 3.3V; VNO_ or VNC_ = 3V, 0.3V;

VCOM_ = 0.3V, 3V

E

-10

10

nA

+25

°C

-2

2

COM_ On-Leakage

Current (Note 7)

ICOM_(ON)

V+ = 3.3V; VNO_ or VNC_ = 3V, 0.3V, or

unconnected; VCOM_ = 3V, 0.3V, or

unconnected

E

-20

20

nA

DYNAMIC CHARACTERISTICS

+25

°C

30

50

Turn-On Time

tON

V+ = 2.7V, VNO_ or VNC_ = 1.5V;

RL = 50

Ω; CL = 35pF; Figure 2

E60

ns

ELECTRICAL CHARACTERISTICS—+3V SUPPLY

(V+ = +2.7V to +3.3V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at +3V and +25°C.)

(Notes 3, 9, 10)

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