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MAX4684 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX4684 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 10 page 0.5 Ω Ω/0.8Ω Ω Low-Voltage, Dual SPDT Analog Switches in UCSP 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (All Voltages Referenced to GND) V+, IN_......................................................................-0.3V to +6V COM_, NO_, NC_ (Note1) ........................... -0.3V to (V+ + 0.3V) Continuous Current NO_, NC_, COM_ .......................... ±300mA Peak Current NO_, NC_, COM_ (pulsed at 1ms, 50% duty cycle).................................±400mA Peak Current NO_, NC_, COM_ (pulsed at 1ms, 10% duty cycle).................................±500mA Continuous Power Dissipation (TA = +70°C) 10-Pin TDFN (derate 18.5mW/°C above +70°C)........1482mW 12-Bump UCSP (derate 11.4mW/°C above +70°C) ...909mW 10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW Operating Temperature Ranges..........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Bump Temperature (soldering) (Note 2) Infared (15s)................................................................+220°C Vapor Phase (60s) ......................................................+215°C Note 1: Signals on NO_, NC_, and COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre- heating is required. Hand or wave soldering is not allowed. PARAMETER SYMBOL CONDITIONS TA MIN TYP MAX UNITS ANALOG SWITCH Analog Signal Range VNO_, VNC_, VCOM_ E0 V+ V +25 °C 0.3 0.5 MAX4684 E 0.5 +25 °C0.45 0.8 NC_ On-Resistance (Note 4) RON(NC) V+ = 2.7V; ICOM_ = 100mA; VNC_ = 0 to V+ MAX4685 E 0.8 Ω +25 °C0.45 0.8 NO_ On-Resistance (Note 4) RON(NO) V+ = 2.7V; ICOM_ = 100mA; VNO_ = 0 to V+ E 0.8 Ω +25 °C0.06 On-Resistance Match Between Channels (Notes 4, 5) ΔRON V+ = 2.7V; ICOM_ = 100mA; VNO_ or VNC_ = 1.5V E 0.06 Ω MAX4684 E 0.15 NC_ On-Resistance Flatness (Note 6) RFLAT (NC) V+ = 2.7V; ICOM = 100mA; VNC_ = 0 to V+ MAX4685 E 0.35 Ω NO_ On-Resistance Flatness (Note 6) RFLAT (NO) V+ = 2.7V; ICOM = 100mA; VNO_ = 0 to V+ E 0.35 Ω +25 °C -1 1 NO_ or NC_ Off- Leakage Current (Note 7) INO_(OFF) or INC_(OFF) V+ = 3.3V; VNO_ or VNC_ = 3V, 0.3V; VCOM_ = 0.3V, 3V E -10 10 nA +25 °C -2 2 COM_ On-Leakage Current (Note 7) ICOM_(ON) V+ = 3.3V; VNO_ or VNC_ = 3V, 0.3V, or unconnected; VCOM_ = 3V, 0.3V, or unconnected E -20 20 nA DYNAMIC CHARACTERISTICS +25 °C 30 50 Turn-On Time tON V+ = 2.7V, VNO_ or VNC_ = 1.5V; RL = 50 Ω; CL = 35pF; Figure 2 E60 ns ELECTRICAL CHARACTERISTICS—+3V SUPPLY (V+ = +2.7V to +3.3V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at +3V and +25°C.) (Notes 3, 9, 10) |
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