High-Efficiency, Seamless Transition,

Step-Up/Down DC-DC Converter

2

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

IN, OUT, SKIP, ON to GND ......................................-0.3V to +6V

REF, FB, to GND...............................................-0.3V, (IN + 0.3V)

Single-Layer Board (derate 18.5mW/°C

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Range

2.5

5.5

V

UVLO Threshold

UVLO

2.20

2.49

V

Quiescent Supply Current, FPWM

Mode, Switching

15

22

mA

Quiescent Supply Current, Skip

Mode, Switching

SKIP = GND, no load

37

µA

Quiescent Supply Current, No

Switching, Skip Mode

SKIP = GND, FB = 1.3V

35

45

µA

0.1

1

Shutdown Supply Current

0.2

µA

3.30

V

-1

+1

%

SKIP mode, valley regulation value

3.28

V

Average skip voltage

3.285

Output Voltage Accuracy

(Fixed Output)

Load step +0.5A

-3

%

Output Voltage Range

(Adjustable Output)

1.25

4.00

V

Maximum Output Current

0.80

A

Soft-Start

250

mA/ms

Load Regulation

0.1

%/A

Line Regulation

0.03

%/V

OUT Bias Current

3

µA

REF Output Voltage

1.244

1.25

1.256

V

REF Load Regulation

1

mV

FB Feedback Threshold

to 5.5V

1.244

1.25

1.258

V

Note 1: LX1 and LX2 have internal clamp diodes to IN, PGND and OUT, PGND, respectively. Applications that forward bias these

diodes should take care not to exceed the device's power-dissipation limits.