1

Motorola Bipolar Power Transistor Device Data

Advance Information

High Speed, High Gain Bipolar

NPN Power Transistor with

Integrated Collector-Emitter

Diode and Built-in Efficient

Antisaturation Network

The BUD44D2 is state–of–art High Speed High gain BIPolar transistor (H2BIP).

High dynamic characteristics and lot to lot minimum spread (

±150 ns on storage time)

make it ideally suitable for light ballast applications. Therefore, there is no need to

guarantee an hFE window.

Main features:

• Low Base Drive Requirement

• High Peak DC Current Gain (55 Typical) @ IC = 100 mA

• Extremely Low Storage Time Min/Max Guarantees Due to the

H2BIP Structure which Minimizes the Spread

• Integrated Collector–Emitter Free Wheeling Diode

• Fully Characterized and Guaranteed Dynamic VCE(sat)

• “6 Sigma” Process Providing Tight and Reproductible Parameter Spreads

It’s characteristics make it also suitable for PFC application.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector–Emitter Sustaining Voltage

VCEO

400

Vdc

Collector–Base Breakdown Voltage

VCBO

700

Vdc

Collector–Emitter Breakdown Voltage

VCES

700

Vdc

Emitter–Base Voltage

VEBO

12

Vdc

Collector Current — Continuous

— Peak (1)

IC

ICM

2

5

Adc

Base Current — Continuous

IB

IBM

1

2

Adc

*Total Device Dissipation @ TC = 25_C

*Derate above 25

°C

PD

25

0.2

Watt

W/

_C

Operating and Storage Temperature

TJ, Tstg

– 65 to 150

_C

THERMAL CHARACTERISTICS

Thermal Resistance

— Junction to Case

— Junction to Ambient

R

θJC

R

θJA

5

71.4

_C/W

Maximum Lead Temperature for Soldering

Purposes: 1/8

″ from case for 5 seconds

TL

260

_C

(1) Pulse Test: Pulse Width = 5 ms, Duty Cycle

≤ 10%.

Designer’s and SWITCHMODE are trademarks of Motorola, Inc.

This document contains information on a new product. Specifications and information herein are subject to change without notice.

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document

by BUD44D2/D

BUD44D2

CASE 369–07

POWER TRANSISTORS

2 AMPERES

700 VOLTS

25 WATTS

CASE 369A–13

MINIMUM PAD SIZES

RECOMMENDED FOR

SURFACE MOUNTED

APPLICATIONS

6.7

0.265

1.6

0.063

2.3

0.090

2.3

0.090

1.6

0.063