High-Power LED Driver with Integrated High-Side LED

Current Sense and PWM Dimming MOSFET Driver

2

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

IN, HV, LV to SGND................................................-0.3V to +30V

OVP+, SENSE+, DIMOUT, CLV to SGND ..............-0.3V to +30V

SENSE+ to LV........................................................-0.3V to +0.3V

HV, IN to LV ............................................................-0.3V to +30V

OVP+, CLV, DIMOUT to LV ......................................-0.3V to +6V

PGND to SGND .....................................................-0.3V to +0.3V

All Other Pins to SGND.............................................-0.3V to +6V

NDRV Continuous Current................................................±50mA

DIMOUT Continuous Current..............................................±2mA

20-Pin TQFN (4mm x 4mm)

(derate 25.6mW/°C* above +70°C) ............................2051mW

20-Pin TSSOP-EP (derate 26.5mW/°C above +70°C) ....2122mW

Junction-to-Ambient Thermal Resistance (

20-Pin TQFN 4mm x 4mm .................................................39°C/W

20-Pin TSSOP..................................................................37.7°C/W

Junction-to-Case Thermal Resistance (

20-Pin TQFN 4mm x 4mm ...............................................6°C/W

20-Pin TSSOP..................................................................2°C/W

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

*

As per JEDEC51 standard (multilayer board).

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Voltage Range

4.75

28

V

Quiescent Supply Current

610

mA

Shutdown Supply Current

30

60

µA

Output Voltage

0

6.3

7

7.7

V

Dropout Voltage

0.65

1

V

Short-Circuit Current

80

300

mA

LINEAR REGULATOR (CLV)

Output Voltage

0

6V

4.7

5

5.3

V

Dropout Voltage

0.5

V

Short-Circuit Current

2.2

10

mA

REFERENCE VOLTAGE (REF)

Output Voltage

0

3.625

3.70

3.775

V

REF Short-Circuit Current

30

mA

UNDERVOLTAGE LOCKOUT/ENABLE INPUT (UVEN)

UVEN On Threshold Voltage

1.395

1.435

1.475

V

UVEN Threshold Voltage

Hysteresis

200

mV

Input Leakage Current

I1I

µA

PWMDIM

PWMDIM On Threshold Voltage

1.395

1.435

1.475

V

PWMDIM Threshold Voltage

Hysteresis

200

mV