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M12S16161A Datasheet(PDF) 5 Page - Elite Semiconductor Memory Technology Inc.

Part # M12S16161A
Description  512K x 16Bit x 2Banks Synchronous DRAM
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Manufacturer  ESMT [Elite Semiconductor Memory Technology Inc.]
Direct Link  http://www.esmt.com.tw/index.asp
Logo ESMT - Elite Semiconductor Memory Technology Inc.

M12S16161A Datasheet(HTML) 5 Page - Elite Semiconductor Memory Technology Inc.

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ESMT
M12S16161A
Operation Temperature Condition -40°C~85°C
Elite Semiconductor Memory Technology Inc.
Publication Date : Sep. 2007
Revision : 1.0
5/30
AC OPERATING TEST CONDITIONS (VDD=2.375~2.625V,TA= -40 to 85 C
°)
Parameter
Value
Unit
Input levels (Vih/Vil)
0.9 x VDDQ / 0.2
V
Input timing measurement reference level
0.5 x VDDQ
V
Input rise and fall time
tr / tf = 1 / 1
ns
Output timing measurement reference level
0.5 x VDDQ
V
Output load condition
See Fig.2
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Version
Parameter
Symbol
-6
-7
Unit
Note
Row active to row active delay
tRRD(min)
12
14
ns
1
RAS to CAS delay
tRCD(min)
18
20
ns
1
Row precharge time
tRP(min)
18
20
ns
1
tRAS(min)
36
42
ns
1
Row active time
tRAS(max)
100
us
Row cycle time
tRC(min)
54
63
ns
1
Last data in to new col. Address delay
tCDL(min)
1
CLK
2
Last data in to row precharge
tRDL(min)
2
CLK
2
Last data in to burst stop
tBDL(min)
1
CLK
2
Col. Address to col. Address delay
tCCD(min)
1
CLK
3
CAS latency=3
2
Number of valid output data
CAS latency=2
1
ea
4
Note: 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and
then rounding off to the next higher integer.
2.
Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
The earliest a precharge command can be issued after a Read command without the loss of data is CL+BL-2 clocks.


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