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AS5SP128K36DQ-40IT Datasheet(PDF) 6 Page - Austin Semiconductor

Part # AS5SP128K36DQ-40IT
Description  Plastic Encapsulated Microcircuit 4.5Mb, 128K x 36, Synchronous SRAM Pipeline Burst, Single Cycle Deselect
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Manufacturer  AUSTIN [Austin Semiconductor]
Direct Link  http://www.austinsemiconductor.com
Logo AUSTIN - Austin Semiconductor

AS5SP128K36DQ-40IT Datasheet(HTML) 6 Page - Austin Semiconductor

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AS5SP128K36DQ
Austin Semiconductor, Inc. reserves the right to change products or modify product specifications with appropriate notification
Revision 1.0 03/22/04
For Additional Products and Information visit out Web site at
www.austinsemiconductor.com
6
COTS PEM
AS5SP128K36DQ
Austin Semiconductor, Inc.
SSRAM
AC Switching Characteristics (VDD=3.3v -5%/+10%,
TA= Min. and Max temperatures of Screening level chosen)
-26 [250Mhz]
-30 [200Mhz]
-35 [166Mhz]
-40 [133Mhz]
Parameter
Symbol
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Units
Notes
Clock (CLK) Cycle Time
tCYC
4.00
-
5.00
-
6.00
-
7.50
-
ns
Clock (CLK) High Time
tCH
1.70
-
2.00
-
2.50
-
3.00
-
ns
1
Clock (CLK) Low Time
tCL
1.70
-
2.00
-
2.50
-
3.00
-
ns
1
Clock Access Time
tCD
-
2.60
3.00
3.50
4.00
ns
2
Clock (CLK) High to Output Low-Z
tCLZ
1.25
-
1.25
-
1.25
-
1.25
-
ns
2,3,4,5
Clock High to Output High-Z
tCHZ
1.25
2.60
1.25
3.00
1.25
3.50
1.25
3.50
ns
2,3,4,5
Output Enable to Data Valid
tOE
-
2.60
-
3.00
-
3.50
-
4.00
ns
6
Output Hold from Clock High
tOH
1.25
-
1.25
-
1.25
-
1.25
-
ns
Output Enable Low to Output Low-Z
tOELZ
0.00
-
0.00
-
0.00
-
0.00
-
ns
2,3,4,5
Output Enable High to Output High-Z
tOEHZ
-
2.60
-
3.00
-
3.50
-
3.50
ns
2,3,4,5
Address Set-up to CLK High
tAS
1.00
1.30
1.50
1.50
ns
7,8
Address Hold from CLK High
tAH
0.50
0.50
0.50
0.50
ns
7,8
Address Status Set-up to CLK High
tASS
1.00
1.30
1.50
1.50
ns
7,8
Address Status Hold from CLK High
tASH
0.50
0.50
0.50
0.50
ns
7,8
Address Advance Set-up to CLK High
tADVS
1.00
1.30
1.50
1.50
ns
7,8
Address Advance Hold from CLK High
tADVH
0.50
0.50
0.50
0.50
ns
7,8
Chip Enable Set-up to CLK High (CEx\, CE2)
tCES
1.00
1.30
1.50
1.50
ns
7,8
Chip Enable Hold from CLK High (CEx\, CE2)
tCEH
0.50
0.50
0.50
0.50
ns
7,8
Data Set-up to CLK High
tDS
1.00
1.30
1.50
1.50
ns
7,8
Data Hold from CLK High
tDH
0.50
0.50
0.50
0.50
ns
7,8
Write Set-up to CLK High (GW\, BWE\, BWx\)
tWES
1.00
1.30
1.50
1.50
ns
7,8
Write Hold from CLK High (GW\, BWE\, BWX\)
tWEH
0.50
0.50
0.50
0.50
ns
7,8
ZZ High to Power Down
tPD
2
2
2
2
cycles
ZZ Low to Power Up
tPU
2
2
2
2
cycles
Notes to Switching Specifications:
1.
Measured as HIGH when above VIH and Low when below VIL
2.
This parameter is measured with the output loading shown in AC Test Loads
3.
This parameter is sampled
4.
Transition is measured +500mV from steady state voltage
5.
Critical specification(s) when Design Considerations are being reviewed/analyized for Bus Contentention
6.
OE\ is a Don't Care when a Byte or Global Write is sampled LOW
7.
A READ cycle is defined by Byte or Global Writes sampled LOW and ADSP\ is sampled HIGH for the required SET-UP and HOLD times
8.
This is a Synchronous device. All addresses must meet the specified SET-UP and HOLD times for all rising edges of CLK when either
ADSP\ or ADSC\ is sampled LOW while the device is enabled. All other synchronous inputs must meet the SET-UP and HOLD times
with stable logic levels for all rising edges of clock (CLK) during device operation (enabled). Chip Enable (Cex\, CE2) must be valid
at each rising edge of clock (CLK) when either ADSP\ or ADSC\ is LOW to remain enabled.


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