SSRAM

SSRAM

SSRAM

SSRAM

SSRAM

AS5SS256K36 &

AS5SS256K36A

AS5SS256K36 &

AS5SS256K36A

Rev. 3.6 06/05

Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.

7

Austin Semiconductor, Inc.

ABSOLUTE MAXIMUM RATINGS*

Storage Temperature (Plastics) ...........................-55

°C to +150°C

Storage Temperature (Ceramics) .........................-55

°C to +125°C

Short Circuit Output Current (per I/O)…............................100mA

Voltage on any Pin Relative to Vss........................-0.5V to +4.6 V

Max Junction Temperature**..............................................+150

°C

V

IN

(DQx) .........................................................-0.5V to V

V

IN

(inputs) ................................................... ....-0.5V to V

*Stresses greater than those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

these or any other conditions above those indicated in the

operation section of this specification is not implied. Exposure

to absolute maximum rating conditions for extended periods

may affect reliability.

** Junction temperature depends upon package type, cycle

time, loading, ambient temperature and airflow, and humidity.

3.3V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS

PARAMETER

CONDITION

SYMBOL

MIN

MAX

UNITS

NOTES

Input High (Logic 1) Voltage

2.2

V

1, 2

Input Low (Logic 0) Voltage

-0.3

0.8

V

1, 2

Input Leakage Current

-2

2

μΑ

3

Output Leakage Current

-2

2

μΑ

Output High Voltage

2.4

--

V

1, 4

Output Low Voltage

---

0.4

V

1, 4

Supply Voltage

3.135

3.6

V

1

Isolated Output Buffer Supply

3.135

3.6

V

1, 5

NOTES:

1. All voltages referenced to Vss (GND).

2. Overshoot: V

KC

/2 for I < 20mA

Undershoot: V

KC

/2 for I < 20mA

Power-up: V

3. MODE and ZZ pins have internal pull-up resistors, and input leakage = +10

μA

4. The load used for V

AC I/O curves are available upon request.

5. V

6. This parameter is sampled.

THERMAL RESISTANCE

DESCRIPTION

SYM

TYP

UNITS NOTES

Thermal Resistance

(Junction to Ambient)

1-layer

40

6

Thermal Resistance

(Junction to Top of Case, Top)

9

6

Thermal Resistance

(Junction to Pins, Bottom)

17

6

CONDITIONS

Test conditions follow standard test

methods and procedures for measuring

thermal impedance, per EIA/JESD51.