ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

Packaged PIN Diodes

RoHS Compliant

Rev V.9

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Features

♦ High Power

♦ Fast Speed

♦ Voltage Ratings to 1500 Volts

♦ Wide Selection of Carrier Lifetimes

♦ Wide Selection of Capacitances

♦ Assortment of Packages Styles

♦ Available Screened for Military Applications

Description and Applications

M/A-COM's broad line of packaged PIN diodes

encompasses a comprehensive range of electrical

characteristics and package outlines. This diverse union

of semiconductor technology and chip packaging gives

considerable flexibility to the circuit designer. The fast

switching series of packaged PIN diodes utilize a thin

I-region and silicon oxide or glass passivated chips

which provide for low leakage currents and low insertion

loss. Using in process control monitors to regulate wafer

fabrication parameters these devices achieve consistent

performance in control circuit applications. The high

voltage product line of packaged PIN diodes employs

M/A-COM's unique CERMACHIP

which provides for a hard glass encapsulation that

hermetically seals the active area of the chip. These

packaged CERMACHIP

for use in high power applications where high RF

voltages are present. The diode chips are bonded into

sealed ceramic packages that are designed for the most

stringent electrical and environmental conditions. A wide

choice of packages are available which can be mounted

into a variety of microwave and RF circuit media. The

Packaged PIN Diodes series are designed to have a

high inherent reliability and may be ordered screened to

meet many MIL-STD reliability levels.

1. Operation beyond any one of the above conditions may

cause permanent damage to the device.

Cathode Heatsink Packages

30,31,32,36,43,94,111,120,

150,255 258,296,1072,1079

T (max Operating)-25°C

Thermal Resistance

Leaded Packages

@+25°C

144, 186, 276,1088

Surface Mount Package

+25°C

1056

Maximum Power Dissipation

Co-Axial Packages

Leaded/Surface Mount Packages

Threaded Packages

Specifications subject to change without prior notification.

Unpackaged Die

Parameter

Absolution Max.

Voltage

As Specified in Table

Operating Temperature

- 65°C to +175°C

Storage Temperature

- 65°C to +200°C

Operating and Storage

(Case Style 1088)

- 65°C to +125°C

31,32,94

36

1056

120,255

276

186

30, 296

1088

1072,1079

150

111

43

258

131,132.134 , 212

Thru

Hole

144