ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

Packaged PIN Diodes

RoHS Compliant

Rev V.9

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Ordering Information

The Packaged PIN Diode specifications shown in the tables on pages 2, 3, & 4 are for the standard style package. The

standard package style is indicated by the number following the dash after the base part number. Note that the

specification tables lists the total diode capacitance for the standard case style. The total capacitance for the base part

in an alternative package will differ and is computed by adding the junction capacitance of the chip and the parasitic

capacitance of the alternative package as defined in the Package Parasitic Capacitance table below. To compute the

chip junction capacitance, subtract the total capacitance shown in the specifications tables on pages 2, 3, & 4 from the

appropriate standard style package capacitance below The various base part numbers are only available in the case

styles shown in the Package Availability Table below. To order, indicate the base part number followed by a dash and

the desired package style.

For example

: The MA4P506-258 is the MA4P506 chip in the 258 style package.

Maximum Soldering Temperature

For hand soldering operation:

Case Style

Case Style:

Case Style:

Package styles that are threaded or have pronged ends rely on a pressure connection and do not require solder

attachment but can be soldered if desired.

For solder reflow profiles:

Refer to application note M-538 on the M/A-COM website using the following link:

http://www.macomtech.com/Application%20Notes/pdf/M538.pdf

Package Availability Table

*Note: “T” after the package style number indicates tape and reel.

Base Part Number

Available ODS Package Styles

MA4P202

120, 134, 276, 1056

MA4P203

30, 32, 94, 111, 134, 1056

MA4P303

32, 36, 94, 120, 186, 255, 1088

MA4P404

30, 31, 36, 111, 132, 258,1072T*

MA4P504

30, 120, 132, 144, 186, 255,1072T*

MA4P505

36, 131, 255, 1072T

*

MA4P506

30, 31, 36, 131, 255, 258, 1072T

*

MA4P604

30, 43, 131, 255, 258

MA4P606

30, 36, 131, 258

MA4P607

43, 212, 296

MA4P709

150

MADP000015-000030

30

MA4PH235

1072T

*

MA4PH236

1072T

*

MA4PH237

1079T

*

MA4PH238

1072T

*

MA4PH239

1079T

*

MADP-000234

10720T* (1072 package style)

Package Style

Cap. (pF)

30

0.18

31

0.18

32

0.30

36

0.18

43

0.75

94

0.15

111

0.27

120

0.13

131

N/A (chip)

132

N/A (chip)

134

N/A (chip)

186

0.15

212

N/A (chip)

255

0.30

258

0.18

276

0.13

296

0.35

1056

0.20

1072

0.16

1079

0.13

1088

0.12

144

0.42

Package Parasitic Capacitance