ADG1608/ADG1609

Rev. 0 | Page 9 of 20

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

1

2

3

4

5

6

7

8

EN

S1

S4

S3

S2

A0

D

16

15

14

13

12

11

10

9

A2

GND

S7

S8

S6

S5

A1

ADG1608

TOP VIEW

(Not to Scale)

Figure 3. ADG1608 Pin Configuration (TSSOP)

PIN 1

INDICATOR

1

2

S1

3

S2

4

S3

12 GND

10 S5

9S6

TOP VIEW

(Not to Scale)

ADG1608

NOTES

1. THE EXPOSED PAD IS CONNECTED

INTERNALLY. FOR INCREASED

RELIABILITY OF THE SOLDER

JOINTS AND MAXIMUM THERMAL

CAPABILITY, IT IS RECOMMENDED

THAT THE PAD BE SOLDERED TO

Figure 4. ADG1608 Pin Configuration (LFCSP)

Table 8. ADG1608 Pin Function Descriptions

Pin No.

TSSOP

LFCSP

Mnemonic

Description

1

15

A0

Logic Control Input.

2

16

EN

Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin

is high, Ax logic inputs determine on switches.

3

1

Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.

4

2

S1

Source Terminal 1. Can be an input or an output.

5

3

S2

Source Terminal 2. Can be an input or an output.

6

4

S3

Source Terminal 3. Can be an input or an output.

7

5

S4

Source Terminal 4. Can be an input or an output.

8

6

D

Drain Terminal. Can be an input or an output.

9

7

S8

Source Terminal 8. Can be an input or an output.

10

8

S7

Source Terminal 7. Can be an input or an output.

11

9

S6

Source Terminal 6. Can be an input or an output.

12

10

S5

Source Terminal 5. Can be an input or an output.

13

11

Most Positive Power Supply Potential.

14

12

GND

Ground (0 V) Reference.

15

13

A2

Logic Control Input.

16

14

A1

Logic Control Input.

N/A

EP

EP

Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and

Table 9. ADG1608 Truth Table

A2

A1

A0

EN

On Switch

X1

X1

X1

0

None

0

0

0

1

1

0

0

1

1

2

0

1

0

1

3

0

1

1

1

4

1

0

0

1

5

1

0

1

1

6

1

1

0

1

7

1

1

1

1

8