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MASW-003100-1192 Datasheet(PDF) 6 Page - M/A-COM Technology Solutions, Inc. |
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MASW-003100-1192 Datasheet(HTML) 6 Page - M/A-COM Technology Solutions, Inc. |
6 / 9 page • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 6 HMIC™ Silicon PIN Diode Switches RoHs Compliant Rev. V6 MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Wire Bonding Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A heat stage temperature of approximately 200oC and a force of 18 to 22 grams should be used. Ultrasonic energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as short as possible. Mounting The HMIC switches have TiPtAu back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive epoxy. Mounting surface must be clean and flat. Eutectic Die Attachment: An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not be used. Epoxy Die Attachment: Surface of assembly should be preheated to 125-150oC. A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer’s schedule. Chip Outline Drawing 1,2 DIM INCHES MM MIN. MAX. MIN. MAX. A 0.014 0.018 0.35 0.45 B 0.025 0.029 0.64 0.74 C 0.008 REF 0.20 REF D 0.004 0.006 0.10 0.15 E 0.004 REF 0.10 REF F 0.003 REF 0.08 REF G 0.003 REF 0.08 REF H 0.020 REF 0.52 REF Notes: 1. Topside and backside surface metallization is gold, 2.5μm thick typical. 2. Yellow areas indicate wire bonding pads. |
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