• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

6

HMIC™ Silicon PIN Diode Switches

RoHs Compliant

Rev. V6

MASW-001100-1190

MASW-002100-1191

MASW-003100-1192

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Wire Bonding

Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is

used. Ultrasonic energy should be adjusted to the minimum required to achieve a good bond. RF bond wires

should be kept as short as possible.

Mounting

The HMIC switches have TiPtAu back metal. They can be die mounted with a gold-tin eutectic solder preform

or conductive epoxy. Mounting surface must be clean and flat.

Eutectic Die Attachment:

An 80/20 gold-tin eutectic solder preform is recommended with a work surface

20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not

be used.

Epoxy Die Attachment:

epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the chip after placement.

Cure epoxy per manufacturer’s schedule.

Chip Outline Drawing

DIM

INCHES

MM

MIN.

MAX.

MIN.

MAX.

A

0.014

0.018

0.35

0.45

B

0.025

0.029

0.64

0.74

C

0.008 REF

0.20 REF

D

0.004

0.006

0.10

0.15

E

0.004 REF

0.10 REF

F

0.003 REF

0.08 REF

G

0.003 REF

0.08 REF

H

0.020 REF

0.52 REF

Notes:

1. Topside and backside surface metallization is gold, 2.5μm thick typical.

2. Yellow areas indicate wire bonding pads.