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MA4E2502L-1246T Datasheet(PDF) 2 Page - M/A-COM Technology Solutions, Inc. |
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MA4E2502L-1246T Datasheet(HTML) 2 Page - M/A-COM Technology Solutions, Inc. |
2 / 5 page 2 SURMOUNTTM Low, Medium, and High Barrier Silicon Schottky Diodes M/A-COM Products Rev. V7 MA4E2502 Series ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/ or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- ment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Electrical Specifications @ 25°C Model Number Type Recommended Freq. Range Vf @ 1 mA (mV) Vb @ 10 uA (V) Ct @ 0 V (pF) Rt Slope Resistance (Vf1-Vf2)/(10.5mA-9.5mA) (Ω) MA4E2502L Low Barrier DC - 18 GHz 330 Max 300 Typ 3 Min 5 Typ 0.12 Max 0.10 Typ 16 Typ 20 Max MA4E2502M Medium Barrier DC - 18 GHz 470 Max 420 Typ 3 Min 5 Typ 0.12 Max 0.10 Typ 12 Typ 18 Max MA4E2502H High Barrier DC - 18 GHz 700 Max 650 Typ 3 Min 5 Typ 0.12 Max 0.10 Typ 11 Typ 15 Max 1. Rt is the dynamic slope resistance where Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA) Handling All semiconductor chips should be handled with care to avoid damage or contamination from per- spiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recom- mended for individual components. The top sur- face of the die has a protective polyimide coating to minimize damage. The rugged construction of these Surmount de- vices allows the use of standard handling and die attach techniques. It is important to note that in- dustry standard electrostatic discharge (ESD) con- trol is required at all times, due to the sensitive na- ture of Schottky junctions. Bulk handling should insure that abrasion and me- chanical shock are minimized. Absolute Maximum Ratings @ 25°C (unless otherwise noted) 1 Parameter Absolute Maximum Operating Temperature -40°C to +125°C Storage Temperature -40°C to +150°C Junction Temperature +175°C Forward Current 20 mA Reverse Voltage 5 V RF C.W. Incident Power +20 dBm RF & DC Dissipated Power 50 mW Electrostatic Discharge ( ESD ) Classification 2 Class 0 Die Bonding Die attach for these devices is made simple through the use of surface mount die attach tech- nology. Mounting pads are conveniently located on the bottom surface of these devices, and are oppo- site the active junction. The devices are well suited for high temperature solder attachment onto hard substrates. 80Au/20Sn and Sn63/Pb37 solders are acceptable for usage. Die attach with Electrically Conductive Silver Epoxy is Not Recommended. For Hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads of the device. When solder- ing to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Reflow the solder paste by applying equal heat to the circuit at both die-mounting pads. The solder joint must Not be made one at a time, creating un- equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after die attach is completed. 2. Human Body Model |
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