MA4L

Series

5

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

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Silicon PIN Limiter Diodes

V13

Notes for Specification and Nominal High Signal Performance Tables:

metal (infinite) heatsink. Chip only thermal resistance values are approximately 2°C/W lower than the

ODS-30 listed package values in the specifications table.

3) Maximum High Signal Performance: Measured using a single shunt diode (die) attached directly to the gold

plated RF housing ground with 2 mil thick conductive silver epoxy in a 50Ω, SMA, connectorized test fixture.

Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick

Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz,

RF pulse width = 1.0 µS, Duty Cycle = 0.001%.

4) Maximum C.W. Incident Power: Measured in a 50Ω, SMA, connectorized housing @ 4GHz utilizing a TWT

amplifier and the same single diode assembly configuration as stated in Note 3 above.

Die Handling and Mounting Information

from perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up

tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.

mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and D.C. ground plane

mounting surface must be free of contamination and should have a surface flatness or < ± 0.002”.

• Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold / tin eutectic solder perform is

recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot

gas is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be

exposed to a temperatures in excess of 320°C for more than 10 seconds.

Instructions”.

• Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied,

approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible

around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive

silver epoxy per the manufacturer’s schedule, typically 150˚C for 1 hour.

1.0µM. Thermo-compression wedge bonding using a .7 to 1 mil diameter gold wire is recommended, depending

on the contact diameter. The heat stage temperature should be set to approximately 200°C with a bonding tip

temperature of 125˚C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary it

should be adjusted to the minimum required to achieve a good bond. Excessive energy or force applied to the top

contact will cause the metallization to dislodge and lift off. Automatic ball bonding may also be used.

assembly information.