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SC16722 Datasheet(PDF) 5 Page - Silan Microelectronics Joint-stock |
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SC16722 Datasheet(HTML) 5 Page - Silan Microelectronics Joint-stock |
5 / 7 page SC16722 HANGZHOU SILAN MICROELECTRONICS CO.,LTD R EV:1.0 2006.04.19 http: www.silan.com.cn Page 5 of 7 CHIP TOPOGRAPHY Chip size: 0.90x0.76 (mm2) Note: The substrate is connected with GND. BONDING PAD COORDINATES Boding pad Symbol X Y Boding pad Symbol X Y 1 DIN -329.10 -263.90 8 GND 330.90 263.875 2 LIN -219.10 -263.90 9 OUT2 220.90 263.875 3 OEBIN -109.10 -263.90 10 CKOUT 110.90 263.875 4 CKIN 0.90 -263.90 11 OEBOUT 0.90 263.875 5 OUT0 110.90 -263.90 12 LOUT -109.10 263.875 6 GND 220.90 -263.90 13 DOUT -219.10 263.875 7 OUT1 330.90 -263.90 14 VDD -329.10 263.875 Note: The original point of the coordinate is the die center. |
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