© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FPF2300/02/03 • Rev. 1.1.3

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

Notes:

1.

Two-layer PCB of 2s0p from JEDEC STD 51-3.

2.

Four-layer PBD of 2s0p from JEDEC STD 51-7.

3.

Soldered thermal pad on a two-layer PCB without vias based on JEDEC STD 51-3.

4.

Soldered thermal pad on a four-layer with two vias connected with GND plane base on JEDEC STD 51-5, 7.

Recommended Operating Range

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Max.

Unit

IN, OUTA, OUTB, ONA, ONB, FLAGB(A), FLAGB(B) to GND

-0.3

6.0

V

Power Dissipation

SO8

0.8(1)

W

1.4(2)

MLP

0.6(3)

2.2(4)

Storage Temperature

-65

+150

°C

Thermal Resistance, Junction-to-Ambient

SO8

158(1)

°C/W

92(2)

MLP

216(3)

57(4)

ESD

Electrostatic Discharge Protection

Human Body Model, JESD22-A114

4000

V

Charged Device Model, JESD22-C101

2000

Symbol

Parameter

Min.

Max.

Unit

IN

Supply Input

1.8

5.5

V

Ambient Operating Temperature

-40

+85

°C