*bei W ≤ 24 mm nur untere Lochreihe

∗

by W ≤ 24 mm only lower hole line

Gurtoberseite

Tape upper side

Gurtunterseite

Tape buttom side

Abwickelrichtung

Unwinding direction

Lage im Gurt

Position in tape

Pin 1

A

X

P

B

K

Production tolerance complying DIN IEC 286-3

Enclosure Type

Tape width W [mm]

Quantity per meter

Quantity per reel

Dimension P

G218B / G223B

24

83,3

850

12

Recommanded Reflow Profile

Standard Shipping Methode

Profile Feature

Pb-Free Assembly/

Sn-Pb Assembly

Profile Feature

Pb-Free Assembly/

Sn-Pb Assembly

Average ramp-up rate (T

3°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

Preheat

-Temperature Min T

smin

-Temperature Min Ts

max

-Time (min to max) (ts)

150°C

200°C

60-180 seconds

Time maintainted above

-Temperature (T

-Time (t

217°C

60-150 seconds

T

3°C/second max

Time maintainted above

-Temperature (T

-Time (t

217°C

60-150 seconds

Time within 5°C of actual Peak

Temperature (t

20-40 seconds

Peak Temperature (T

max 260°C

Ramp-down Rate

6°C/ second max

Note: All temperatures refer to topside of the package, measured on the package body surface.

SMD oscillators must be on the top side of the PCB during the reflow pocess.

FX-701 page: 6/7

htttp://www.vectron.com

Vectron International•267 LowellRoad, Hudson, New Hampshire 03051•Tel:+1-88-VECTRON-1

Vectron International GmbH & Co. KG • Landstraße, 74924 Neckarbischofsheim, Germany • Tel: +49 7268 801 100