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M24L816512SA-55TEG Datasheet(PDF) 5 Page - Elite Semiconductor Memory Technology Inc.

Part # M24L816512SA-55TEG
Description  8-Mbit (512K x 16) Pseudo Static RAM
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Manufacturer  ESMT [Elite Semiconductor Memory Technology Inc.]
Direct Link  http://www.esmt.com.tw/index.asp
Logo ESMT - Elite Semiconductor Memory Technology Inc.

M24L816512SA-55TEG Datasheet(HTML) 5 Page - Elite Semiconductor Memory Technology Inc.

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ESMT
M24L816512SA
Elite Semiconductor Memory Technology Inc.
Publication Date : Jun. 2009
Revision : 1.5
5/14
AC Test Loads and Waveforms
Parameters
3.0V VCC
Unit
R1
22000
R2
22000
RTH
11000
VTH
1.50
V
Switching Characteristics Over the Operating Range[10, 11, 12, 13, 14]
-55
-70
Parameter
Description
Min.
Max.
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
55[14]
70
ns
tAA
Address to Data Valid
55
70
ns
tOHA
Data Hold from Address Change
5
5
ns
tACE
CE LOW to Data Valid
55
70
ns
tDOE
OE LOW to Data Valid
25
35
ns
tLZOE
OE LOW to LOW Z[11, 12]
5
5
ns
tHZOE
OE HIGH to High Z[11, 12]
25
25
ns
tLZCE
CE LOW to Low Z[11, 12]
5
5
ns
tHZCE
CE HIGH to High Z[11, 12]
25
25
ns
tDBE
BLE
/ BHE LOW to Data Valid
55
70
ns
tLZBE
BLE
/ BHE LOW to Low Z[11, 12]
5
5
ns
tHZBE
BLE
/ BHE HIGH to High Z[11, 12]
10
25
ns
tSK[14]
Address Skew
0
10
ns
Notes:
10. Test conditions assume signal transition time of 1V/ns or higher, timing reference levels of V CC(typ)/2, input pulse levels of 0V
to V CC(typ), and output loading of the specified IOL/IOH and 30-pF load capacitance
11. tHZOE, tHZCE, tHZBE, and tHZWEtransitions are measured when the outputs enter a high-impedance state.
12. High-Z and Low-Z parameters are characterized and are not 100% tested.
13. The internal write time of the memory is defined by the overlap of WE , CE = VIL, BHE and/or BLE = VIL. All signals
must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up
and hold timing should be referenced to the edge of the signal that terminates write.
14. To achieve 55-ns performance, the read access should be CE controlled. In this case tACE is the critical parameter and tSK
is satisfied when the addresses are stable prior to chip enable going active. For the 70-ns cycle, the addresses must be
stable within 10 ns after the start of the read cycle.


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