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M24L816512SA-70TIG Datasheet(PDF) 3 Page - Elite Semiconductor Memory Technology Inc. |
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M24L816512SA-70TIG Datasheet(HTML) 3 Page - Elite Semiconductor Memory Technology Inc. |
3 / 14 page ESMT M24L816512SA Elite Semiconductor Memory Technology Inc. Publication Date : Jun. 2009 Revision : 1.5 3/14 Product Portfolio Product Power Dissipation Operating ICC(mA) VCC Range (V) f = 1MHz f = fMAX Standby, ISB2(µA) Product Min. Typ. Max. Speed(ns) Typ.[5] Max. Typ.[5] Max. Typ. [5] Max. 55 22 M24L816512SA 2.7 3.0 3.6 70 2 5 11 17 55 100 110(for Vcc > 3.3V) Notes: 2.DNU pins are to be left floating or tied to VSS. 3.Ball G2, H6 are the address expansion pins for the 16-Mbit and 32-Mbit densities respectively. 4.NC “no connect”—not connected internally to the die. 5.Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC (typ) and TA = 25°C. |
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