ESMT

M52S32162A

Operation Temperature Condition -40°C ~85°C

Elite Semiconductor Memory Technology Inc.

Publication Date : Jul. 2007

Revision : 1.0

11/30

SIMPLIFIED TRUTH TABLE

COMMAND

CKEn-1

CKEn

CS

RAS

CAS

WE

DQM BA A10/AP

A11,

A9~A0

Note

Mode Register Set

H

X

L

L

L

L

X

OP CODE

1,2

Register

Extended Mode Register

Set

H

X

L

L

L

L

X

OP CODE

1,2

Auto Refresh

H

3

Entry

H

L

L

L

L

H

X

X

3

L

H

H

H

3

Refresh

Self Refresh

Exit

L

H

H

X

X

X

X

X

3

Bank Active & Row Addr.

H

X

L

L

H

H

X

V

Row Address

Auto Precharge Disable

L

4

Read &

Column Address

Auto Precharge Enable

H

X

L

H

L

H

X

V

H

Column

Address

(A0~A7)

4,5

Auto Precharge Disable

L

4

Write & Column

Address

Auto Precharge Enable

H

X

L

H

L

L

X

V

H

Column

Address

(A0~A7)

4,5

Burst Stop

H

X

L

H

H

L

X

X

6

Bank Selection

V

L

4

Precharge

Both Banks

H

X

L

L

H

L

X

X

H

X

4

H

X

X

X

Entry

H

L

L

V

V

V

X

Clock Suspend or

Active Power Down

Exit

L

H

X

X

X

X

X

X

H

X

X

X

Entry

H

L

L

H

H

H

X

H

X

X

X

Precharge Power Down Mode

Exit

L

H

L

V

V

V

X

X

DQM

H

X

V

X

7

H

H

X

X

X

No Operation Command

H

X

L

H

H

H

X

X

Entry

H

L

L

H

H

L

X

Deep Power Down Mode

Exit

L

H

X

X

X

X

X

X

(V= Valid, X= Don’t Care, H= Logic High , L = Logic Low)

Note:

1. OP Code: Operation Code

A0~ A11/AP, BA: Program keys.(@MRS). BA=0 for MRS and BA=1 for EMRS.

2.

MRS/EMRS can be issued only at both banks precharge state.

A new command can be issued after 2 clock cycle of MRS.

3.

Auto refresh functions are as same as CBR refresh of DRAM.

The automatical precharge without row precharge command is meant by “Auto”.

Auto / self refresh can be issued only at both banks precharge state.

4.

BA: Bank select address.

If “Low”: at read, write, row active and precharge, bank A is selected.

If “High”: at read, write, row active and precharge, bank B is selected.

If A10/AP is “High” at row precharge, BA ignored and both banks are selected.

5. During burst read or write with auto precharge, new read/write command can not be issued.

Another bank read /write command can be issued after the end of burst.

6. Burst stop command is valid at every burst length.

7. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0), but

makes

Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)