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M52S128324A-10TG Datasheet(PDF) 6 Page - Elite Semiconductor Memory Technology Inc.

Part # M52S128324A-10TG
Description  1M x 32 Bit x 4 Banks Synchronous DRAM
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Manufacturer  ESMT [Elite Semiconductor Memory Technology Inc.]
Direct Link  http://www.esmt.com.tw/index.asp
Logo ESMT - Elite Semiconductor Memory Technology Inc.

M52S128324A-10TG Datasheet(HTML) 6 Page - Elite Semiconductor Memory Technology Inc.

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ESMT
M52S128324A
Elite Semiconductor Memory Technology Inc.
Publication Date: Mar. 2009
Revision: 1.4
6/47
AC OPERATING TEST CONDITIONS
(VDD = 2.5V ± 0.2V ,TA = 0 to 70 C
°)
Parameter
Value
Unit
Input levels (Vih/Vil)
0.9XVDDQ / 0.2
V
Input timing measurement reference level
0.5xVDDQ
V
Input rise and fall-time
tr/tf = 1/1
ns
Output timing measurement reference level
0.5xVDDQ
V
Output load condition
See Fig. 2
(Fig. 1) DC Output Load Circuit
(Fig. 2) AC Output Load Circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Version
Parameter
Symbol
-7
-10
Unit
Note
Row active to row active delay
tRRD(min)
14
20
ns
1
RAS to CAS delay
tRCD(min)
18
30
ns
1
Row precharge time
tRP(min)
20
30
ns
1
tRAS(min)
42
50
ns
1
Row active time
tRAS(max)
100
us
@ Operating
tRC(min)
70
80
Row cycle time
@ Auto Refresh
tRFC(min)
70
80
ns
1
Last data in to col. address delay
tCDL(min)
1
CLK
2
Last data in to row precharge
tRDL(min)
2
CLK
2
Last data in to burst stop
tBDL(min)
1
CLK
2
Output
VOH (DC) =2.4V , IOH = -2 mA
VOL (DC) =0.4V , IOL = 2 mA
Output
30pF
Z0 =50
30pF
50
Vtt = 0.5xVDDQ
VDDQ
500
Ω
500
Ω
Ω
Ω


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