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BM-20EG88MD Datasheet(PDF) 1 Page - BRIGHT LED ELECTRONICS CORP

Part # BM-20EG88MD
Description  hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
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Manufacturer  BRIGHT [BRIGHT LED ELECTRONICS CORP]
Direct Link  http://www.brightled.co.kr
Logo BRIGHT - BRIGHT LED ELECTRONICS CORP

BM-20EG88MD Datasheet(HTML) 1 Page - BRIGHT LED ELECTRONICS CORP

  BM-20EG88MD Datasheet HTML 1Page - BRIGHT LED ELECTRONICS CORP BM-20EG88MD Datasheet HTML 2Page - BRIGHT LED ELECTRONICS CORP BM-20EG88MD Datasheet HTML 3Page - BRIGHT LED ELECTRONICS CORP  
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background image
B
BR
RIIG
GH
HT
T L
LE
ED
D E
EL
LE
EC
CT
TR
RO
ON
NIIC
CS
S C
CO
OR
RP
P..
B
BM
M--2
20
0E
EG
G8
88
8M
MD
D
Ver.1.0 Page 1 of 3
SINCE 1981
Package Dimensions :
3.00(.118) MIN.
60.20(2.370)
8.90(.350)
2.54x11=27.94(1.100)
60.20(2.370)
0.50(.020)
PIN 1.
+
45.72(1.800)
5.0(.197)
Notes:
1.
All dimensions are in millimeters(inches).
2.
Tolerance is ±0.25mm(.01")unless otherwise
specified.
3.
Specifications are subject to change without
notice.
Features :
1.
2.30 inch (60.20mm) matrix height.
2.
Dot size 5.00mm.
3.
Low power requirement.
4.
Excellent characters appearance.
5.
Solid state reliability.
6.
Multiplex drive , column anode com.
and row cathode com.
7.
Multi color available.
8.
Categorized for luminous intensity.
9.
Stackable vertically and horizontally.
Description :
1.
The BM-20EG88MD is a 60.2mm (2.30")
matrix height 8×8 dot matrix display.
2.
This product use hi-eff red chips and
green chips, the hi-eff red chips are
made from GaAsP on GaP substrate,
the green chips are made from GaP
on GaP substrate.
3.
This product have a black face and
white dots.
4.
This product doesn't contain restriction
substance, comply ROHS standard.
Internal Circuit Diagram :
佰鴻工業股份有限公司
http://www.brtled.com


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