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MB39C007QN Datasheet(PDF) 9 Page - Fujitsu Component Limited. |
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MB39C007QN Datasheet(HTML) 9 Page - Fujitsu Component Limited. |
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9 / 52 page  MB39C007 DS04-27246-2E 9 ■ ABSOLUTE MAXIMUM RATINGS *1 : See the diagram of “ ■ EXAMPLE OF STANDARD OPERATION CHARACTERISTICS. Power dissipation vs. Operating ambient temperature” for the package power dissipation of Ta from + 25 °C to + 85 °C. *2 : When mounted on a four-layer epoxy board of 11.7 cm × 8.4 cm *3 : IC is mounted on a four-layer epoxy board, which has thermal via, and the IC's thermal pad is connected to the epoxy board (Thermal via is 9 holes). *4 : IC is mounted on a four-layer epoxy board, which has no thermal via, and the IC's thermal pad is connected to the epoxy board. Notes: • The use of negative voltages below − 0.3 V to the AGND, DGND1, and DGND2 pin may create parasitic transistors on LSI lines, which can cause abnormal operation. • This device can be damaged if the LX pins are short-circuited to AVDD and DVDD1/DVDD2, or AGND and DGND1/DGND2. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. Parameter Symbol Condition Rating Unit Min Max Power supply voltage VDD AVDD = DVDD1 = DVDD2 −0.3 +6.0 V Signal input voltage VISIG OUT1, OUT2 pins −0.3 VDD + 0.3 V CTLP, CTL1, CTL2, MODE1, MODE2 pins −0.3 VDD + 0.3 VREFIN1, VREFIN2 pins −0.3 VDD + 0.3 VDET pin −0.3 VDD + 0.3 XPOR pull-up voltage VIXPOR XPOR pin −0.3 +6.0 V LX voltage VLX LX1, LX2 pins −0.3 VDD + 0.3 V LX Peak current IPK The upper limit value of ILX1 and ILX2 ⎯ 1.8 A Power dissipation PD Ta ≤ +25 °C ⎯ 3125*1, *2, *3 mW ⎯ 1563*1, *2, *4 Ta = +85 °C ⎯ 1250*1, *2, *3 mW ⎯ 625*1, *2, *4 Operating ambient temperature Ta ⎯−40 +85 °C Storage temperature TSTG ⎯−55 +125 °C |
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