VIV0103THJ

Rev. 1.3

9/2009

Page 9 of 16

V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200

vicorpower.com

PRELIMINARY DATASHEET

2.1 MECHANICAL DRAWING

2.2 RECOMMENDED LAND PATTERN

mm

(inch)

Notes:

1. Maintain 3.50 (0.138) Dia. keep-out zone

free of copper, all PCB layers.

2. (A) minimum recommended pitch is 24.00 (0.945)

this provides 7.50 (0.295) component

edge–to–edge spacing, and 0.50 (0.020)

clearance between Vicor heat sinks.

(B) Minimum recommended pith is 25.50 (1.004).

This provides 9.00 (0.354) component

edge–to–edge spacing, and 2.00 (0.079)

clearence between Vicor heat sinks.

3. V•I Chip land pattern shown for reference

only, actual land pattern may differ.

Dimensions from edges of land pattern

to push–pin holes will be the same for

all half size V•I Chips.

4. RoHS complient per CST–0001 latest revision.

5. Unless otherwise specified:

Dimensions are mm (inches)

tolerances are:

x.x (x.xx) = ±0.13 (0.01)

x.xx (x.xxx) = ±0.13 (0.005)

6. Plated through holes for grounding clips (33855)

shown for reference, Heatsink orientation and

device pitch will dictate final grounding solution.

2.95±0.07

(0.116±0.003)

non-plated

thru hole

See note 1

ø

7.63

(0.300)

7.00

(0.276)

22.26

(

(0.876)

)

3.50

(

(0.138)

)

10.50

(

(0.413)

)

21.00

(0.827)

Dashed lines indicates

half VIC position

(NO GROUNDING CLIPS)

(WITH GROUNDING CLIPS)

2.76

(0.109)

24.00

(0.945)

See Note 2A

15.48

(

(0.609)

)

2.95±0.07

(0.116±0.003)

non-plated

thru hole

See note 1

ø

7.63

(0.300)

7.00

(0.276)

22.26

(

(0.876)

)

3.50

(

(0.138)

)

15.48

(

(0.609)

)

Dashed lines indicates

half VIC position

10.50

(

(0.413)

)

21.00

(0.827)

0.76

(0.030)

22.52

(0.887)

0.44

(0.017)

6.12

(0.241)

25.50

(1.004)

See note 2B

2.76

(0.109)

2.03

(0.080)

(2) Pl.

plated

thru hole

See note 6

ø

2.3 RECOMMENDED LAND PATTERN FOR PUSH PIN HEATSINK