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VIV0103MHJ Datasheet(PDF) 9 Page - Vicor Corporation |
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VIV0103MHJ Datasheet(HTML) 9 Page - Vicor Corporation |
9 / 16 page VIV0103THJ Rev. 1.3 9/2009 Page 9 of 16 V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 vicorpower.com PRELIMINARY DATASHEET 2.1 MECHANICAL DRAWING 2.2 RECOMMENDED LAND PATTERN mm (inch) Notes: 1. Maintain 3.50 (0.138) Dia. keep-out zone free of copper, all PCB layers. 2. (A) minimum recommended pitch is 24.00 (0.945) this provides 7.50 (0.295) component edge–to–edge spacing, and 0.50 (0.020) clearance between Vicor heat sinks. (B) Minimum recommended pith is 25.50 (1.004). This provides 9.00 (0.354) component edge–to–edge spacing, and 2.00 (0.079) clearence between Vicor heat sinks. 3. V•I Chip land pattern shown for reference only, actual land pattern may differ. Dimensions from edges of land pattern to push–pin holes will be the same for all half size V•I Chips. 4. RoHS complient per CST–0001 latest revision. 5. Unless otherwise specified: Dimensions are mm (inches) tolerances are: x.x (x.xx) = ±0.13 (0.01) x.xx (x.xxx) = ±0.13 (0.005) 6. Plated through holes for grounding clips (33855) shown for reference, Heatsink orientation and device pitch will dictate final grounding solution. 2.95±0.07 (0.116±0.003) non-plated thru hole See note 1 ø 7.63 (0.300) 7.00 (0.276) 22.26 ( (0.876) ) 3.50 ( (0.138) ) 10.50 ( (0.413) ) 21.00 (0.827) Dashed lines indicates half VIC position (NO GROUNDING CLIPS) (WITH GROUNDING CLIPS) 2.76 (0.109) 24.00 (0.945) See Note 2A 15.48 ( (0.609) ) 2.95±0.07 (0.116±0.003) non-plated thru hole See note 1 ø 7.63 (0.300) 7.00 (0.276) 22.26 ( (0.876) ) 3.50 ( (0.138) ) 15.48 ( (0.609) ) Dashed lines indicates half VIC position 10.50 ( (0.413) ) 21.00 (0.827) 0.76 (0.030) 22.52 (0.887) 0.44 (0.017) 6.12 (0.241) 25.50 (1.004) See note 2B 2.76 (0.109) 2.03 (0.080) (2) Pl. plated thru hole See note 6 ø 2.3 RECOMMENDED LAND PATTERN FOR PUSH PIN HEATSINK |
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