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LP3982-18J5F Datasheet(PDF) 7 Page - Lowpower Semiconductor inc |
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LP3982-18J5F Datasheet(HTML) 7 Page - Lowpower Semiconductor inc |
7 / 8 page Preliminary Datasheet LP3982 LP3982 – Ver. 1.0 Datasheet Dec.-2006 Page 7 of 8 The power dissipation definition in device is : PD = (VIN−VOUT) x IOUT + VIN x IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = ( TJ(MAX) − TA ) /θJA Where TJ(MAX) is the maximum operation junction temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of LP3982, where TJ(MAX) is the maximum junction temperature of the die (125°C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance (θJA is layout dependent) for SC-70-5 package is 250°C/W. PD(MAX) = (125°C−25°C) / 250 = 400mW (SC-70-5) PD(MAX) = (125°C−25°C) / 165 = 606mW The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. |
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