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EDE2516AASE-AE Datasheet(PDF) 8 Page - Elpida Memory

Part # EDE2516AASE-AE
Description  256M bits DDR2 SDRAM for HYPER DIMM
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Manufacturer  ELPIDA [Elpida Memory]
Direct Link  http://www.elpida.com/en
Logo ELPIDA - Elpida Memory

EDE2516AASE-AE Datasheet(HTML) 8 Page - Elpida Memory

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EDE2508AASE/16AASE-DF, -BE, -AE
Preliminary Data Sheet E0515E12 (Ver. 1.2)
8
max.
Parameter
Symbol
Grade
× 8
× 16
Unit
Test condition
-DF
270
270
-BE
270
270
Auto-refresh current
IDD5
-AE
260
260
mA
tCK = tCK (IDD);
Refresh command at every tRFC (IDD) interval;
CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
6
6
Self-refresh current
IDD6
mA
Self Refresh Mode;
CK and /CK at 0V;
CKE
≤ 0.2V;
Other control and address bus inputs are FLOATING;
Data bus inputs are FLOATING
-DF
340
475
-BE
340
475
Operating current
(Bank interleaving)
IDD7
-AE
330
460
mA
all bank interleaving reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = tRCD (IDD)
−1
× tCK (IDD);
tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD),
tRCD = 1
× tCK (IDD); See Notes 7;
CKE is H, CS is H between valid commands;
Address bus inputs are STABLE during DESELECTs;
Data pattern is same as IDD4W;
Notes: 1. IDD specifications are tested after the device is properly initialized.
2. Input slew rate is specified by AC Input Test Condition.
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, /DQS, RDQS, /RDQS, LDQS, /LDQS, UDQS, and /UDQS. IDD
values must be met with all combinations of EMRS bits 10 and 11.
5. Definitions for IDD
L is defined as VIN
≤ VIL (AC) (max.)
H is defined as VIN
≥ VIH (AC) (min.)
STABLE is defined as inputs stable at an H or L level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between H and L every other clock cycle (once per two clocks) for address and control
signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals
not including masks or strobes.
6. Refer to AC Timing for IDD Test Conditions.
7. In case of -DF (DDR2-700), tRCD must be 2
× tCK (IDD) and AL must be 4 × tCK (IDD) because AL = 5 is
not supported in this device.
AC Timing for IDD Test Conditions
For purposes of IDD testing, the following parameters are to be utilized.
DDR2-700
DDR2-667
DDR2-600
Parameter
5-6-6
5-5-5
5-5-5
Unit
CL(IDD)
5
5
5
tCK
tRCD(IDD)
15
15
15
ns
tRC(IDD)
67.5
60
65
ns
tRRD(IDD)
7.5
7.5
7.5
ns
tCK(IDD)
2.85
3
3.3
ns
tRAS(min.)(IDD)
50
45
47.5
ns
tRAS(max.)(IDD)
70000
70000
70000
ns
tRP(IDD)
15
15
15
ns
tRFC(IDD)
85
75
80
ns


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